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PCB Design Guidelines For Reduced Electromagnetic Interference

PCB Design Guidelines For Reduced Electromagnetic Interference

Printed circuits should be well designed and well-built to help devices work accurately. These circuits should have good materials to minimize certain issues, including the high EMI or electromagnetic interface. On the other hand, poor design can cause weak signals and high radiation, disabling the device. Here, we will discuss all essentials of EMI and how to reduce it.
Electromagnetic interference or EMI is defined as any disturbance that affects an electrical circuit due to either electromagnetic induction or electromagnetic radiation. The effects of EMI can range from a simple degradation of signal quality to complete equipment failure. In order to avoid these negative effects, it is important to design your Printed Circuit Board with EMI in mind.
Reduced electromagnetic interference (EMI) on your circuit board ensures that your electronic devices and products don’t interfere with nearby electronics and may even improve the overall performance of your products. We will share some key tips that you can follow to help reduce the EMI generated by your circuit boards and improve the performance of your final products.

PCB Design Guidelines For Reduced Electromagnetic Interference
PCB Design Guidelines For Reduced Electromagnetic Interference

Optimizing the EMI PCB Design

Electromagnetic interference has many reasons,and you have to reduce it through the filter.You can create the EMI filters using a single component or a network of many components having dedicated circuits to reduce different mode noises. Now, we will discuss the EMI filter design and its standard types.
After deciding on the basic EMI design, you will have to optimize it through a circuit board’s specifications. Like, if the purpose of the EMI filter design is to drive other PCBs, you must add more filter elements to have smoothing, isolation, and limits of electrical parameters. The limitof meeting the board’s needs depends on the PCB design capabilities and the available analysis methods.

How PCB EMI Happens

You will see electromagnetic frequencies everywhere all around you, such as appliances, or electronic products having current. EMI falls into different categories when it comes to PCB.

  • High-power devices cause EMI, like amplifiers, antennas, processors, FPGAs transmitters, etc.
  • Moreover, the change of components can also cause interference affecting g the device.
  • EMI often occurs along traces and at connector points. Unnecessary coupling occurs between the ground planes and signal paths because of lost capacitance.
  • EMI also happens due to external sources, like when the board is near a source that emits radiation. This external source can be a device, equipment, or some other circuit board.

It is very hard to eliminate all types of EMI sources, but following certaindesign rules can help in this case. You can minimize the disturbing noises through different techniques that we will describe in this article.
What Are EMI Design Guidelines?
Like every PCBoard, there are certain design parameters to follow while designing a suitable EMI filter design. You have to adopt a certain perspective in this case, as described below.
PCB Design Perspective 2-Dimensional
First of all, you have to make marks for component placementwhich you can do through a design software library, or you can upload a file taking it from other sources. It also involves spacing, routing of traces, and design clearances. But, you will have to consider a few things to do so, such as:

  1. Make sure that component libraries and pads are compatible.
  2. There should be a maximum distance between the adjacent elements, such as traces, pads, and annular rings, as it will reduce the EMI.
  3. Designers should consider the types ofsignals for component partitioning.
  4. Make sure that the trace size or width is according to the required current capacities.
  5. The impedance compatibility should be addressed in terms ofexcellent power transfer and differential routing.
  6. Make sure to provide thedepenalization according to the terms and conditions of the board clearance.
  7. Devices with high radiation should be shielded.
  8. Silkscreen should be used wisely to enhance PCB assembly through reference points and component polarities.

Various Techniques To Minimize EMI

Design should involve minimum EMI, and you can achieve it by adopting different techniques.

Reducing The EMI Through A Ground Plane

The first barrier against EMI is the ground plane, as PCB needs a floating surface to function effectively. Printed circuit boards have a ground plane to give a reference line of 0 volts and take it to the power supply terminal for a circuit’s return path.

The circuit board becomes an antenna when there is noise due to ripples. A circuit board’s copper foil or the ground planeoccupies the maximum cross-sectional area of the circuit board. So, you can reduce the EMI or electromagnetic interference by effectively using the ground plane.

Reducing EMI Through Trace Layout

The conductive paths on the circuit boards are known as traces. Flowing electrons occur in traces due to an active circuit and are a little away from developing a radiating antenna.There are certain guidelines to follow regarding trace layouts, such as:

  • There should not be bends with sharp angles. Instead,round right angles are suitable to reduce reflections that occur due to an increase in capacitance in the corner areas lying at 45 degrees.
  • High-speed traces should be away from the low-strength signals. You can take an example of a clock that has high-speed signals. Whereas analog and digital signals should also be separate from each other.
  • The return paths should not be long, instead, make them short.
  • The differential traces should be close enough to enhance coupling. This techniquebrings influenced noises into a less problematic mode.
  • There should be a wise usage of vias as they help you take benefit of a circuit board’s multiple layers while routing.Designers should know that thereflections happen due to a change in impedance.
  • Different traces should not have vias. However, in case you need so, then you can have an oval anti-pad which two vias share, reducing the parasitic capacitance.

SomeWays of Reducing EMI from Components

  • Try to choose low-power consumption components.
  • You can use USB circuits within an enclosure, like PCB guards or Faraday cages. They can also eliminate the EMI from the circuitboard’s surroundings.
  • Use heat dissipation methods to avoid the EMI. Proper heat sinks and vias help in this case.
  • All the above techniques and guidelines can help you reduce EMI. But, the design, function, and PCB performance goals determine the EMI reduction technique you should choose.

Some Other Ways

Place decoupling capacitors close to the power pins of your ICs. These provide more capacitance closer to the source, reducing both conducted and radiated EMI.
Make sure you are soldering all components with enough solder so that there is no exposed metal at any point on the circuit board.
If possible, position sensitive analog circuits such as amplifiers or comparators away from digital circuits such as processors or microcontrollers.
Shielding (copper foil) can be used in conjunction with shielding paint to improve RF performance further. Shielding paint is usually made of copper powder mixed into an acrylic binder. The copper reacts chemically with air, so shielding paint should not be used in damp environments where there may be high humidity or condensation levels. In most cases, paints will have a shelf life of up to five years if stored in a dry place without exposure to sunlight.

EMI Optimized Circuit Board through PSpice

There is a simulation tool known as PSpice which can help you to analyze the electrical parameters of a PCB design. However, it should be done before submitting your design for construction.
Ithelps evaluate heat dissipation and distribution methods, different simulations, anda circuit’s behavior in different conditions.
You can use the PSpice Advanced Analysis tool for this purpose. You can optimize a PCB for minimizing EMI by following the design guidelines and using advanced methods.

FAQs

What is EMI in PCB?
Electromagnetic interference or EMI is defined as any disturbance that affects an electrical circuit due to either electromagnetic induction or electromagnetic radiation.
How To Reduce EMI?
You can reduce PCB EMI through traces, a ground plane, PSpice, and some other methods.
What Are the Reasons For EMI?
High-power devices cause EMI, like amplifiers, antennas, processors, FPGAs transmitters, etc. The change of components can also cause interference affecting the device.

Wrap Up

Electromagnetic interference (EMI) from power lines and high-voltage devices can damage circuitry, which can lead to failures in equipment and even safety issues. This article focuses on PCB design guidelines that will help you prevent EMI on your PCBs by making them less susceptible to outside interference, particularly during the power-up sequence.
By applying the guidelines described in this article, your designs will have lower susceptibility to radiated emissions, conducted emissions, and common-mode currents, making them less vulnerable to damage from outside sources of EMI.
Would like to know more about design guidelines for reduced EMI or printed circuit board assembly? Email us at sales@pnconline.com

Written by Sam Sangani

Sam Sangani

Sam Sangani is the President & CEO of PNC Inc., a Nutley, NJ based Printed Circuit Board manufacturer. Sam graduated from L. D. Engineering College with a BS Degree in Mechanical Engineering. He also continued his education and graduated from Steven’s Institute of Technology where he acquired a Master’s degree in Computer Science.

After completion of his BS, Sam worked as a QC Manager, for Xerox, Romania and London. He was responsible for the Quality Control of Cable and Wire Harness imports from Romania. After completing his Master’s Degree, he worked as a Senior Programmer with IBM, Tucson, Arizona. Sam was responsible for leading the Mainframe System Programming Team.

In 1997, Sam acquired PNC INC., a Nutley, NJ based PC Board fabrication Shop. From 1997-2013, Sam has made tremendous improvements and changes within PNC INC., as he added many new Products and Technologies in PNC’s portfolio. With his proven track record and leadership, PNC has never had an unprofitable year and has continued its growth yearly since 1997.

His current responsibilities are Strategic Planning, Corporate Management, New Business Ventures, Sales & Marketing, Trade Shows, Professional Services and leading productive teams to achieve peak potential. He has also utilized Lean Management techniques which have built a foundation for PNC’s high-paced growth. Sam also enjoys real-estate investing, web design & SEO, trading stocks, options, futures and Forex markets.

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