Tag Archives: PC board manufacturer

RF Microwave PC Board Applications

RF Microwave PC Board Applications

There are numerous uncertainty in RF (radio frequency) PCB (printed circuit board) designs. Whenever it comes to circuits with frequencies below microwave (particularly low intermediate frequencies digital logic circuits), however, careful design is the only way to ensure first-time circuits designing effectiveness while mastering all design concepts.

Plated-through hole (PTH) has been used to connect traces on various layers simultaneously, and resistance is frequently integrated inside the layer stacking or generated by selectively laying down resistant material. Most of the needed electronic systems are usually put on the top and bottom layers, with interconnections created among parts and traces using soldering or wire bonding. The microwave efficiency, as well as the physical behavior in the predicted surroundings, is heavily influenced by the structure of the underlying layers.

Nevertheless, 2 to 3 PCB variants can ensure circuit reliability at frequencies beyond microwaves and high-frequency PC-level digital logic circuits. Nevertheless, at frequencies above microwaves, more generations of PCB design are required for continuous improvement in RF circuits. As a result, various challenges are almost expected to arise along with the process of RF circuit design.

RF Layout Concept

The preceding broad principles should be followed while designing an RF layout:

● As often as feasible, high power amplifiers (HPAs) and low noise amplifiers (LNAs) must be separate. High-frequency RF transmitting circuits were separated from low-frequency RF receiver circuits by a large distance.
● On the high-frequency portion of the PCB boards, at least a detailed ground must be accessible, and through-hole must be avoided. The more copper foil surface area there is, the better.
● Circuit and electricity are both affected by decoupled in the same way.
● The distance between the RF output and the RF input must be as large as possible.

Those circuit boards are made to work at moderate and incredibly high frequencies (megahertz and gigahertz). They should be made out of high-quality materials. Here are a few of them:

● RO laminates are made by Rogers.
● FR-4 High-Performance
● Hydrocarbons loaded with ceramics
● Woven or tiny glass fibers in PTFE

Particular properties of materials include a low optical tangential, a low dielectric (Er), and outstanding Coefficients of Thermal Expansion (CTE).

PCB Requirements for RF Radio Frequency

The RF PCBs have dielectric thicknesses of 0.1 to 3.5mm and are available in copper with weights ranging from 0.5oz to 15oz with UL certifications of 80z. With a minimum line width and spacing of 0.075mm, they have a thermal capability of 0.82 W/mK.

It can build the best-fit solutions for your important RF electronics product using our comprehensive understanding of accessible RF substrates, driven product development, and long-term product sustainability.

Purity PCB could assure that all price objectives and budget were reached through early coordination, future ensuring your RF board products to the least potential price point, with a proactive and challenging attitude to costs monitoring.

Purity delivers the degree of reliability, reproducibility, and affordability to bring any RF Microwave Printed Circuit Board demand to fulfillment, from one-off prototype needs to producing a manufacturing suite of products.

Framework and Methodology of RF Circuit Design

Higher – frequency Printed Wiring Boards are required for applications such as network and communication (PCBs). Whenever these organizations approach PCB makers for a solution, the manufacturers typically suggest Radio Frequency (RF) or microwaves PCBs. PCB makers recommend these PCB assemblies for information and telecommunication application for a variety of reasons. Let’s have a glance at certain fundamentals.

Physical segmentation and electronics separating are two types of partitioning. The first is primarily involved with the part arrangement, orientation, and shields, whilst it is divided into power systems, RF routes, sensitivity circuitry, signaling, and ground partition.

A. Concept of Physical Partitioning

The principle of element design:

Components design is critical to achieving a successful RF system. The most efficient method is to first fix parts along the RF line and have their orientation changed so the RF route may be minimized with input far enough from outputs and low – and high circuitry segregated as much as feasible.

The principle of PCB laminating

A most effective method of Circuit board fabrication is to place the primary surface on the two layers beneath the first planes and the RF traces on the first layer. The diameter of the RF route via holes must be limited.

The idea of RF tracking and RF parts

The design of RF tracking and RF parts Linear circuitry such as multi-stage amplifiers can separate all RF regions within the physical environment, but duplexers, mixers, and mid-frequency amplifier/mixers frequently cause mutual interfering among several RF/IF channels. As a result, this form of influence should be avoided at all costs. Crossing RF/IF traces and leaving a grounding around them is recommended. The proper RF routing is critical to PCB efficiency, hence why components layout takes up the majority of the design effort in cell phones.

B. Principles of Electronics Partitioning

The concept of transmitting power:

Because the DC in most mobile phone circuits is usually relatively low, tracing width isn’t an issue. Tracing with a high flow and as broad a breadth as feasible, on the other hand, should be constructed separately again for energy availability of quality amplifier to keep transmission voltage to a minimal. Numerous through apertures must be used to transmit energy from one plane to the other to prevent massive power losses.

High-power systems’ energy decoupling:

If perfect couplings at the supply pins of a high-power amplifier are not accomplished, high-power noises would be emitted throughout the boards, causing numerous problems. Grounding is critical for high-power amplifiers, and a metal shielding covering is frequently required in their designs.

The concept of RF input/output separation:

For most cases, it also is critical to ensure that RF outputs are far from RF inputs, this applies to amplifiers, bumpers, and filters. In the worst-case scenario, self-excited vibrations may result if the amplifiers and bumpers inputs are restored to respective input terminals at an acceptable amplitude and phase. In ideal circumstances, they would be able to perform reliably at any voltage and temperature. In reality, they could become unstable, causing noise and interference signals to be added to RF transmissions.

Overall, because of its spread variable circuits, RF circuits have skin impact and coupler impact, which distinguishes them from low-frequency circuits and DC. As a consequence, the difficulties highlighted above should be given extra attention during the designing of RF circuit PCBs to ensure that the circuit is both precise and efficient.

Advantages of RF Microwave PCB Applications

Along with its multiple evident advantages, RF PCB has seen the quickest development. The following are a few of the numerous advantages:

Quick operating ability:

Because RF PCBs operate at such a high frequency, they can effectively provide the signals in the circuits in a short period. The total gadget can work faster than ever before due to the obvious quickest connectivity among the materials due to speedy information transit. As a result, smartphones, aeronautical devices, and other RF PCB products can operate in a matter of seconds.

Multi-layered board:

RF PCBs can be used in circuits with various layers based on the stack-up from the PC Board manufacturer. This ability to stake out allows people to work at their best. Multi-layered circuits have high densities that allow them to fit into a tiny device. It also minimizes the circuit’s likely weight and making it more convenient to use.


Several layers The PCB kind of RF is a significant influence in lowering the circuit’s costs. The price of the circuits constantly decreases as the weight and size of the circuits decreases.

Pitching element placement:

The finer-pitched materials of the circuits may be easily placed just on RF PCB due to its sophistication. This is critical to remember while beginning the process.

Strong Sensitivity Strength:

Among all the positive aspects of the RF PCB, its high-temperature stress endurance energy is overlooked. It’s a boon for industries that work in high-temperature conditions. Any regular PCB would fail to work in such a hot environment as found in the army, airline, and automotive sectors, but RF PCB, with its extreme sensitivity capability, is just like a ray of sunshine in those domains.

At PNC, you can get your RF microwave design or PCB Assembly requirements fulfilled. Just Email us at sales@pnconline.com.

Acceptability Criteria of Printed Circuit Boards, what standard do you use?


As a printed circuit board manufacturer, PNC Inc., Nutley, NJ, our criteria of acceptability during the inspection process is determined by IPC–A–600. The scope of this document describes the acceptable and non-conforming conditions of a bare boards either externally or internally during the final inspection process. The inspection criteria is then broken down into three classifications of acceptability, Class I, Class II and Class III. Each class’s acceptance criteria is then again broken down into three areas, target condition, acceptable, and nonconforming for the imperfections in question.

At times there can be a disconnect or confusion between the end-user and the manufacturer in terms of acceptability criteria. Why? Is the PC board manufacturer shipping inferior product, or not interpreting the IPC standard incorrectly? Does the end-user use a standard for acceptability during incoming inspection, such as IPC-6012? These are only a couple of questions why there may be a disconnect in determining the acceptance or nonconformance of a bare rigid board.

The intention of this blog is to help inform and decipher the IPC–A–600 acceptance criteria for a bare printed circuit board. Over the next few months, I will break down imperfections with pictorials, and explanations of the acceptance, or nonconformance for a particular imperfection. I will start with the most common defects seen in the manufacturing process of a PC Board.

Today, I’d like to look at one of the most common occurrences, external annular ring of supported holes. The condition in question is where the drill in the plated through hole appears to be off center in the pad, as seen in figure 1 below. This occurrence happens because of manufacturing tole rance build ups through the process. The two main contributors are Drilling and Primary Imaging.


Figure 1

The combined tolerance between the two processes for most PC Board Manufacturers can be +/- .003 for positional accuracy. Typically most Drilling Machines have a positional accuracy of anywhere from .0005” – .001”, whereas primary imaging photo tool registration can be out as much as .003” due to film stretch or shrinkage. In knowing that there are manufacturing tolerances involved, let’s look at the IPC rule for this condition.

According to IPC-A-600, Acceptability of Printed Circuit Boards, we need to determine the minimum annular ring of the supported hole. This can be found in section 2.10.3 External Annular Ring-Supported Holes, as seen in Figure 2103a, since there is no break out. As you can see the target condition is where the hole is centered within the land.


The ruling criteria can also be found in Table 3-5 Minimum Annular Ring from IPC-6012B. For the holes in question from Figure 1, the inspection process used Class II as their criteria.

After viewing the customer’s original Gerber data, we find that the annular ring is specified at .009 “. Our findings at the narrowest point of the annular ring measured was .006” on the board. We know that it does not meet the Target condition for Class II per IPC, so we’ll look at the acceptable condition from Figure 2103b.


In this case, Class III is the only acceptable criteria for this condition which states, “Holes not centered in the lands, but the annular ring measures .050 mm or .002” or more. Also during the observation, there were no defects such as pits, dents, nicks, pinholes or Splay, so we do not use the 20% rule for this condition. Knowing that we have more than .002” of annular ring remaining, this condition passes the inspection process per IPC-A-600 section 2.10.3.

I realize to most of you that this is very elementary, and the rule is straight forward. In saying that, we find ourselves defending the IPC rules with individuals whom are unaware of IPC-A-600 and/or IPC-6012 standards. Over the past 20+ years in this business, I have seen great strides in companies having their employees educated and/or certified to IPC standards. I can only hope the trend continues.