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Better BGA routing on a Printed Circuit Board with High Density Interconnect
Posted On 2 December 2020 BY Sam Sangani Filed Under Circuit board fabrication, PC Board, PC Board fabrication, PCB Fabrication, Pga Capabilities
One of the technologies that have allowed electronic products to shrink in size and provide increasingly higher performance is the ball grid array (BGA) IC package. The BGA allows higher density Printed Circuit Board [1] layouts because of simple geometry. The number of pins that can be accommodated on the perimeter of a quad pack increases linearly with package size. The number of connections that can be accommodated on a BGA increases with the square of the package size. BGA packages now routinely exceed 1000 connections, and the ball pitch has shrunk from 1.0 mm to .8 mm to a growing ...