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What is a Gerber Viewer in PCB Design

What is a Gerber Viewer in PCB Design?

Gerber Viewer

A Gerber viewer is any software application that enables you to examine the contents of a Gerber file. While some of these applications need installation, others are available online and do not require downloading or installation. All you have to do to see your Gerber files online is upload them.

Gerber files

Before the establishment of Gerber files, there were no industry-standard guidelines for manufacturing printed circuit boards (PCB). The papers that included the Printed Circuit Board requirements contained a diverse range of information. There have been many instances of miscommunication and misunderstanding between consumers and manufacturing firms. Finally, universal interoperability across PCB designers and manufacturers has been achieved with the introduction of the Gerber format. In order to work with a file format independent of the CAE/CAD program being utilized, it allows the latter.

After the project has been finished and adequately monitored, it should be sent to the manufacturer. The designer may transmit securely, with prior permission with the business, any Gerber files generated by the export feature. Even though many applications automatically export to this kind of archive, all documents may be compressed in one zipped file. Many firms accept just one compressed file. Testing and checking your files with various Gerber viewers is usually intelligent practice before sending them to the producer. It is a great technique to be followed by all designers.

The Gerber format

These are vector documents consisting of a series of instructions that create a visual object flow. The directions for making the hole on the PC Board are also included. Nowadays, businesses that manufacture printed circuit boards need clients, nothing else. The essential program for electronic design contains and allows the export of the whole work to this format. It is thus the first thing an electrical designer should look for in his CAE program.

pc board

The standard format now used is RS-274X. It’s an extreme version in the same document as it contains:
• the draw and flash commands
• the XY coordinates
• the openings
• the configuration parameters

Versions of Gerber Files

Nobody needs to order a delayed printed circuit board (PCB). Ideally, you submit your design file to the PCB maker, and then the manufacturer organizes the manufacturing of the board based on your file and sends goods to you. However, the actual issue is not so easy. It typically takes such a long time since you submit your designed file to the final arrival of your board. Your discontent with your PC Board manufacturer will grow with increasing turn-time.

You may do a lot to reduce this time from your viewpoint throughout the whole process. After all, efficiency and efficiency are your responsibility. As connectors and translators for PCB engineers and PCB manufacturers, German files serve a crucial role in allowing manufacturers to understand design engineers’ thoughts and ideas. Excellent and dependable products may be produced successfully and efficiently. There are now three Gerber format versions available:
• Gerber X2 – the latest Gerber format, including stack data and characteristics
• RS-274-X – an extended Gerber format version and extensively used.
• RS-274-D – Gerber’s oldest version, progressively replacing RS-274-X.

Over the years, the Gerber file format has seen numerous modifications and upgrades. Thus Gerber files have been updated in many versions. The earliest version, also known as RS-274-D, is Standard Gerber. It is mainly out of usage today, and standard Gerber files are not acceptable on the official website of Gerber. Gerber is extended to include RS-274-X, commonly known as X-Gerber. Extended Gerber was introduced in 1998 and is a human-readable ASCII format. The previous format has been enhanced by incorporating information in graphics and pictures. Gerber’s latest version is Gerber-X2, an expansion of Gerber-X. It is compatible with most CAM programs and enables the user to add file characteristics.

These characteristics are like labels that offer picture file information and features. It also simplifies the transition of PCB designs from CAD to manufacturing. UCAMCO has just launched another version named Gerber X3. While not extensively utilized, UCAMCO believes that its interoperability with other applications and simplicity of installation will become the new norm.

Gerber Files Generation

PCB engineers should never be too indolent to create their Gerber files for the following two reasons. You cannot be sure that the PCB software you use is the same as the software used by your PCB Manufacturer. You must create Gerber files yourself if your PCB producer utilizes various PCB software, and additional discussion and validation will certainly cause extra time and delay the manufacturing process.

Although PCB manufacturer utilizes the same PCB design tools, it is still advisable to create Gerber files yourself since differences in software applications may also lead to potential mistakes. PCB design engineers should thus learn to create Gerber files themselves in order to guarantee delivery speed and reliability of end products.

Gerber files typically include driver layer, solder mask layer, and silkscreen layer design data. In addition, Gerber files should still be produced to prevent potential misunderstandings in two levels with the same design data. Distinct PCB design software has different Gerber file generating operation procedures.

Converting Gerber Files

Depending on the circuit design software you choose, you can generate Gerber files. There are many of these applications. However, some of them are popular with Proteus, Altium Designer, and CircuitMaker. Eagle is also one of the simplest to use. You will have to change your approach to various programs, but here are basic principles. Created by a firm called Gerber, Gerber’s format now includes standard PCB software that is generally recognized, capable of defining board imaging conditions, such as driver layers, solder mask layers, and legendary layers. The printed circuit boards are intended to produce additional board manufacture information based on which board production is started, using a specialist EDA system (Electronic Design Automation) or a CAD system (Computer-Aided Design).

PCB producers will not completely grasp all PCB design file specifics unless it includes the Gerber file as reference and guidance. For each picture of a circuit board, the Gerber format file is applied and may be used for both manufacture of bare boards and the assembly of PCB. For bare-board production, Gerber format is required by conventional photoplotters and other factories that want image data such as legendary printers, direct images or AOI devices, etc.

Simply stated, Gerber files format must be dependent from the beginning to the conclusion of the PCB manufacturing process. In connection with PC Board assembly, a stencil layer is included in the Gerber size, and component positions are controlled, which is also considered as important reference data for the assembly, assembly, and combinations of SMT (Surface Mount Technology).

You need to load your board to the design programme of your circuit. Sometimes this process is easy, but sometimes certain export parameters need to be adjusted. You must next utilize the CAM processor to convert your data to Gerber files. The duration of this procedure varies significantly depending on the size and complexity of the board.

Once you have completed your CAM processor, you will have a set of files labeled with the name of your board but various extensions. You must compress and submit your layer files, drawings, box guidelines, and inside layers to the PCB maker. In order to generate the required Excellon files, you must typically return to the CAM procedure.

Now that you have your Gerber file, maybe your question is how to convert a Gerber to PDF? You will need to locate an online service or application to convert Gerber files to PDF files. Many of these applications are online and do not need your computer to be downloaded or installed. Just upload and wait for the software to convert your files.

Example circuit diagram

The figure below, along with the 3D construction, illustrates the transistor amplifier wiring schematic. It is a promiscuous project, some of them in SMT with discreet components. The project contains elements, words, images, components, and more.

Example circuit diagram

Final Thoughts

Gerber Viewer Software for Windows is a software program that allows you to read and examine Gerber files (GRB files) using its comprehensive toolkit. Some of these applications are also the software for the Gerber editor so that you may examine and modify Gerber PCB designs. The program may export the file viewer in different formats, such as SVG, PDF, PNG, PDF, JPEG, etc. If you wish, you may also print out the design.

PNCONLINE equipped with big and sophisticated machinery, are used CNCs may accomplish the more advanced versions are devoted to a particular operation or all jobs simultaneously. These machines start producing PCBs instantly without being linked to a computer and also can interpret Gerber client files directly thus equipped with processors. Other kinds of equipment, always in accordance with the Gerber requirements, can conduct circuit controls and automated optical inspections (AOI).

Interested in getting your PCB design done on an urgent basis in New Jersey? Get it done at PNCONLINE.

Contact us at sales@pnconline.com

Flexible Printed Circuit Board Overview

Flexible Printed Circuit Board Overview


On a slightly less romantic level, it would not be feasible to have such a standard laptop or mobile phone without flexible print circuit technology, which enables components to be linked electrically, in a dynamic, three-dimensional fashion. Flexible circuit technology has a long history that dates back over 100 years. The early patent activity emphasizes the fact that inventions such as Thomas Edison, Frank Sprague, and others in the early twentieth century experimented on ideas for flexible circuit materials and designs that were only used on a commercial basis in recent decades.


Flexible printed circuits (FPCs) are the heart and soul of flexible films and thin layers of conducting traces. These typically represent the flexible circuit laminate base that can be used to connect electronic equipment – such as the LCD screen or a laptop’s keyboard – as a reliable cable replacement, or electronic components can be directly fitted to it through solder or conductive adhesive to form a completed, flexible printed circuit board.

Flexible printed circuits
Flexible printed circuits

Flexible PCB advantages

Flexible, FPCs may be bent and curved to provide more flexibility of application design and operation. Flexible circuits may also be adapted to tiny or inappropriately shaped areas, which cannot be supported by conventional rigid circuits. There is another benefit of flexible PC Board is that to reduce the weight of the motherboard of the application, they need less space. The effective utilization of existing areas also helps to improve thermal management and reduce the dissipation of heat.

Flexible PCBs may also be more dependable and longer-lasting compared to stiff PCBs, particularly in situations where constant vibration and mechanical stress are experienced. Based on soldered wires and hand-connected connector models, standard connecting methods are replaced by flexible printed circuits, with exceptional weight and thickness, and with strong mechanical resistance.

Think for example of connecting numerous electronic equipment, such as dashboards, display, and man-machine interfaces, in the automobile industry (rotary controls, buttons, etc.). All these gadgets are exposed to constant mechanical strains and vibrations and need a stable connection in all vehicle operating circumstances. Flexible printed circuits ensure zero reliability, durability, and maintenance in the automobile industry.

Flexible PCBs
Flexible PCBs

Flexible printed circuit boards provide a variety of possible advantages including:

  • Flexible PCBs provide cost-effective benefits that include decreased requirements for materials and packaging, reduced component replacement costs, and assembly mistakes that may lead to repair requirements.
  • These advantages make flex PCBs suitable for a broad variety of sectors, including consumer electronics, transport, medical, communications, military, automotive, industrial applications, and aerospace.

Missing Dielectric Material Callouts

Flexible and stiff flexible circuits are made utilizing a variety of material types to satisfy a broad range of physical and electrical costs and performance criteria. Because of this variation, the designer must give comprehensive information on the dielectric materials to be utilized about the potential problems associated with each choice. It is suggested that designers learn about the cost and performance options available. The Internet is filled with information about flexible circuit materials and how they may be utilized. This issue may also be helped by the PCB manufacturer. The fundamental kinds of flex materials are:

  • Adhesive materials without acrylic binding the copper to dielectric polyimide
  • Adhesive materials with acrylic copper bonding with dielectric polyimide
  • Flammable and non-flammable laminates, covers, and bonding flakes.

Incomplete or Insufficient Rigid-Flex Base Material Type Definition

The selected base material determines the rigid-flex circuit’s performance limitations in-process and field operation in many applications. For most solders devoid of plumage, the highest temperature requirements for soldering may be as high as 260°C, which usually requires the use of polyimide laminates. The choice of material and its electrical characteristics may, however, influence other performance problems.

One important issue is to control the characteristic impedance of the system and guarantee signal integrity with increasingly prevalent designs of higher-frequency circuits (these latter subjects will be given more attention later). The requirements for the temperature range of the stiff laminates used in rigid-flex structures must also be taken into account and handled. The stiff material should be capable of high temperatures. Polyimide laminate is a frequent callout, although epoxy resins are often appropriate for better applications.

Copper Type and Thickness Callout

Whilst many metal foils are available for flexible circuits, copper is the most frequently utilized metal for electronic interconnections. It is extremely conductive, mixable (making it flexible and foldable), reasonably easy to manufacture via graving and placing, and relatively cheap. The copper type most often used for flexible circuits is roll and copper (RA copper) with the greatest characteristics for dynamic flex applications.

The choice of type and thickness for the copper design should correspond to the electrical and mechanical requirements for use. Thicker copper is usually utilized for greater energy and thinner copper for circuits requiring repetitive bending (dynamic flexing). The options of thickness are many, but at present, one ounce (17μm or 0.7mils) and one ounce (35μm or 1 mil) are the most utilized for creating flexible circuit laminates. Additional copper may often be placed on the circuit, and this should also be taken into account in the specification. If the designer is unsure, he should seek the assistance of engineers for advice.

Flex Circuits
Flex Circuits

Cover layer or Solder Mask Over Flex Circuits

Covers are polymer materials used for the covering and protection of the copper traces of the flex circuit product. As is indicated, many solutions for the protection of the circuits are accessible and they meet various design criteria in terms of cost, performance, and flexural durability optimization. It is essential to describe the choice not only of the kind of cover material but also of the thickness required. This may be extremely significant for certain building types, especially when a flex circuit experiences dynamic flexing during usage.

As far as costs are concerned, a flexible solder mask is usually the cheapest. Someone or two-layer flexible circuits, which are not subjected to repeated flex cycles or severe radius curves, may be covered with a solder mask epoxy-based to flex without breaking. However, this is not advised if the design needs severe or dynamic flexing.

The second choice is the laminated cover. These materials are usually identical to the flexible core materials and are best suited for flexible dynamic circuit applications. The cover is a polyimide sheet with one side acrylic adhesive. It is usually pre-machined to open the sheet where the final finish is needed.

The cover sheets are typically coated with specific pads in a laminating machine to ensure that the copper characteristics of the flex layer are conformed. For rigid-flex circuits, the overlayer is usually reduced to not exceed 50 miles in the rigid part. The aim is to ensure that all the plated holes in the stiff-flex are empty of any acrylic adhesive, since they may influence the integrity of the hole wall plating.

Flexible Printed Circuit Board disadvantages

Although there are many significant benefits, the FPC technology also has several inconveniences or downsides. First and foremost, FPCs have significant one-time startup costs compared to conventional rigid PCBs. The initial expenses associated with the circuit and prototype design are greater than for rigid PCBs because flexible systems are developed for highly particular purposes. If the cost is a deciding factor in the choice of the kind of PCB, the use of FPC technology is preferable only for not too low manufacturing quantities.

The difficulty of fixing or changing the PCB when it is rebuilt is another drawback. In this situation, in reality, the protection film that covers the circuit must first be removed, the procedure carried out and protection restored. In order to provide their clients with this kind of product, flexible PCBs are quite a new technology and not all manufacturers are prepared. Moreover, considerable care must be exercised during the assembling stage, because the circuit may be easily destroyed by improper handling or by unauthorized people.


The historical electric connection methods have been revolutionized, typically for connecting various portions of the same circuit or different electronic devices by introducing flexible PCBs. The flexible PCB-based solution enables significant space, weight, and costs to be reduced compared to an equivalent solution using rigid PCBs due to its flexibility and compactness as well as the high density of electrical connections available. Many kinds of cable systems, frequently manual in multiple applications, have been replaced with flexible printed circuits which reduce overall electrical cable costs by up to 70%.

Interested in getting your Flexible PCB design ready at economical rates in USA? Get it done at PCNONLINE.

Final Thoughts

In the last few years, the FPC business has expanded significantly led by the development of wearable and electromedical devices that are increasingly tiny and light. Flexible PCBs may remove connector and cable requirements in many applications, enhance connection reliability and reduce assembly time, assembly cost, and total device sizes. We can state that flexible PCBs have enabled new in conclusion, fascinating applications to be implemented that are not possible with conventional rigid PCBs.

Flexible printed circuits, from cars, VCRs, camcorders, cell phones, and SLR cameras up to the complex military and aviation systems, are present in all areas. There are numerous high-profile uses of flexible circuits. One example is the employment of flexible-circuit technology in the Sojourner, a robot that explored the Mars surface and collected data in the summer of 1997, in the stiff flexible wire harnesses employed.

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Smt Assembly Conformal Coating

SMT Assembly Conformal Coating


Conformal coating is a thin layer of protected polymeric coating applied to printed circuit boards (PCBs) and electronic components. Its goal is to provide environmental and mechanical protection for the components and circuits, allowing them to last longer and be more reliable. It maintains long-term surface insulation resistance values by being electrically insulating, ensuring the assembly’s operational integrity. It also prevents corrosion by acting as a barrier to airborne pollutants from the operational environment, like salt spray.

Conformal coatings are often applied in the 25-250 micron range. Parylene films, on the other hand, are applied significantly thinner and can be fractions of a micron thick. Conformal coatings are a flexible covering that will secure the printed circuit board assembly from the environment it is in by filtering out air pollutants and ensuring long-term interface resistance value while also allowing any moisture trapped in the circuit board to dissipate.

The notion of conformal electronics coating was first conceived and refined through research decades ago to suit the rigorous requirements of the military. HumiSeal was a pioneer and leader in that early research and the company has remained a pioneer and leader for over 60 years as the technology has spread to a variety of industries, including:

  • Industrial Controls
  • Automobiles like Hybrid and Electric Vehicles
  • Aerospace
  • Telecoms
  • Traditional and renewable energy
  • White thing

 Conformal coating types

While there are many other types of coatings, including a few specialist forms, five primary categories are depending on the chemical makeup of the substances.

  1. Urethane Resin (UR):

Single-part or two-part urethane resins are available. It is chemically resistant as well as humidity resistance. On the other side, it is simple to remove and rework with a soldering iron.

  1. Acrylic Resin (AR):

Preformed acrylic polymers that have been dissolved in a solvent are known as acrylic. Typically, they are one-part compounds. It is inexpensive and simple to apply and remove. During the curing method, there is no distortion.

  1. Epoxy Resin (ER):

Epoxy coatings are typically two-part compounds, but a one-part option is also available. It has moistures. It performs admirably in adverse conditions.

  1. Silicone Resin (SR):

Silicone resin coatings are one-component materials that are frequently used on devices that will be exposed to severe temperatures. Even at high temperatures, it performs excellently. It can stick to almost any PCB material.

  1. Parylene (XY)

Chemical vapor deposition is the method used to apply parylene coatings. When heated, parylene turns into a gas. It is then placed in a vacuum chamber to polymerize and form a film after cooling. After that, the film is applied over the circuitry. It is translucent and colorless. It is the ideal solvent for coating and can be done at room temperature.

Uses of conformal coating

When today’s dynamic electronics are faced with significant environments, additional protection is required to ensure proper operation. Moisture, salt sprays, strong chemicals and solvents, vapors, dust, abrasion, and even organic assault have all been proved to be resistant to conformal coatings. Furthermore, it has been demonstrated that the impact of mechanical stress and disturbances on the circuit and its functionality in severe temperature ranges can be reduced by using the right material. Conformal coatings protect the product while also improving its reliability. As a result, the negative impacts of early field failures are reduced, as is the potential cost. We use conformal coating for:

  • It works as a moisture and humidity-resistant barrier, resulting in lower leakage currents, converse, and electrical and chemical transfer throughout the board.
  • The coating has the potential to improve the strength of dielectric conductors.
  • The coating provides a high level of insulation safety, allowing conductor space to be reduced.
  • It prevents the board from chemical and corrosive attacks that can cause corrosion. It also protects against damage caused by hard handling, as well as thermal and mechanical load.
  • The coating prevents particle pollutants from reaching the board’s surface.

 Method of conformal coating

The following are types of common Printed Circuit Board conformal coatings:

  1. Brushing

Brushing a conformal coating is a popular method of application. Although this is a simple procedure, it needs the use of a trained operator to ensure the coating’s quality and finish. A brush, a container for storing the coating, and a specified area for application are all required. The coating material is dipped in the brush and applied to the board.

The type of brush, operator competence, coating viscosity, the environment, and the coating material all affect the brushing method’s quality. It has many benefits, including ease of use, simplicity, and reduced process control needs. This method is ideal for rework and low-volume production. In this process, we use hands and are thicker and less pleasing artistically. This is the ideal option for individuals who don’t have the tools to use other options or who are working on a few boards at once.

  1. Spraying:

This procedure produces a better surface polish and is more cost-effective, but it does not penetrate the board deeply. Spraying, which is also preferable for low-volume production, is time-consuming because all parts that do not require coating must be masked. Spraying with aerosols, batch spraying, and selective spraying are all part of this approach.

A spray gun is included with an aerosol. It’s a coating with a solvent basis. Aerosol spraying in a spray booth is a low-cost option. This procedure is superior to brushing because of the inexpensive setup costs, high process speed, simplicity, and final quality.

Batch spraying utilizes a compressed air spray cannon to provide a high-quality coating finish. For the setup, you’ll need a spray gun, a spray booth, and an air compressor. In this operation, it’s crucial to get the spray gun set up with the right atomization pressure and material supply. It’s also crucial to get the coating’s viscosity just correct. It has features such as inexpensive setup costs and flexibility.

Spraying selectively only coatings selected areas. The coating isn’t applied to regions that need to be masked, like connectors and other components. The coating is done with the use of a customized robot system that uses various spray patterns. Valve selection, board material, and board arrangement are all important considerations. The correct spray valve and coating viscosity must be selected.

All sorts of conformal coatings are supported by the spray approach, and designing for this procedure necessitates a high level of technical knowledge. As a result, spray application requires significant capital expenditure. In addition, the material’s performance over time and changes in the control environment must be monitored.

  1. Dipping:

Dipping is the process of immersing a board in a coating solution and then removing it. This process is ideal for high-volume assembly since it is quick, precise, and penetrates the board, coating the entire assembly. However, to eliminate leakage, masking must be flawless, rendering many boards unsuitable owing to design. This approach can only be used on boards that take coating on both sides.

This is a conventional procedure that involves dipping the pcb assembly into a tank of coating chemicals. The speed of immersion, coating dwell time, and board withdrawal speed are the variables that determine the process. Acrylics and urethanes, which are solvent-based conformal coatings, are recommended for dipping. It’s a high-speed process that can be used in batch or in-line processes.

The conformal coating manufacturing process

In the conformal coating production process, there are eight main steps:


The cleaning eliminates a variety of residues that result from operator handling, soldering, machine use, and pollution from the environment.


Priming is the process of applying a preliminary coating to a board before applying the conformal coating. It improves adherence and produces a binding layer to keep the coating in place. The amount of priming required varies depending on the type of resin.


The function of masking is to prevent the conformal coating from being placed on the parts and selected board sections. Because of the insulating nature of the coating, certain regions of the circuit board must remain uncoated. Many materials are used in masking.

Cure and dry:

There is a difference between Cure and dry. That is:


This means that the coating achieves the desired qualities (electrical and mechanical) and that the board is protected while in use.


This assures that the PCB is laminated and suitable for the users to operate. It could take anywhere from a few minutes to several days.


In the procedure, it is the most crucial stage. Manual inspection, UV lamp visibility, and automated optical inspection are all included.

Benefits of conformal coating

When it comes to choosing parylene coating that meets standards, there are several clear advantages and benefits. Because there is no liquid phase in this technique, there will be no pooling of coating in low regions. Furthermore, it will not bridge in substrate features. Furthermore, this sort of coating is extremely pure and is one of the best dielectric qualities available. It’s one of the purest polymer types. It also possesses the best mechanical and gas barriers, allowing it to suit a wide range of coating requirements, even when applied in thin layers.

It protects against impurities such as dust, filth, fungi, moisture, chemicals, thermomechanical stress, mechanical shock, and vibration, as well as environmental, mechanical, electrical, and chemical issues.

Finally, remember the project and the electronics’ user needs in mind when selecting a coating for your printed circuit board or other electronics. It’s necessary to preserve the board, but it’s even more critical to cover it with the right material. When choosing a coating type, keep the environment in mind as well as any rework or repair requirements.

Smt Assembly
Smt Assembly

At PNC, get your conformal coatings done at affordable rates. Contact us at sales@pnconline.com

HDI Printed Circuit Board

HDI Printed Circuit Board

HDI boards, another of the highest technology in PCBs, also are accessible at Incredible. HDI Panels have blind and hidden visas and typically include MicroVAX of .006mm or below in size. They feature a greater circuit complexity than ordinary circuit boards.

What is HDI PCB?

HDI stands for High-Density Interconnector. Any SATA connector with a greater wire volume per square meter than a regular board is termed HDI circuit board. HDI PCBs feature narrower gaps and outlines, more minor visa and grab pads, and increased connecting pad frequency. It is beneficial in boosting electrochemical characteristics and lowering the shape and volume of the device. HDI PCB is the superior alternative for the supervisor/ and pricey laminated PCBs.


The circuit should have different characteristics for high-speed signal electrical demands The thickness of the board should be increased by downsizing and configurations of the electrical components. The board is also highlighted with outstanding high density, thanks to the assembly procedures for leadless, fine pitched packaging, and simultaneous chip connection.

Difference between standard PC Board and HDI PCBs

HDI naturally offered superior system reliability than non-HDI since the use of tiny blind and entered visas reduces all stretching capacities and inductivities. Because there are no gaps, MicroVAX resistance is near the trace frequency. The straying capacitance of a typical passage is substantially larger, resulting in more impedance irregularity than a sensor. The following are some of the main distinctions between HDIs and regular PCBs:

Typical PCBs:

  • Less than HDI
  • Bigger and heavier panels
  • Through-holes
  • Thermal mechanics
  • Higher layer numbers
  • May experience low-pitch performance issues


  • Higher square inch component concentration
  • Smaller, thinner, more useful PCBs
  • Blind, concealed, and MicroVAX solution
  • Direct optical drilling
  • Medium access number
  • increased pin count and small pitch compatibility packages

Layout for HDI?

High-density (HDI) interconnection design refers to a series of strategies to design a PCB where trace widths typically decrease around eight miles (0.2 mm). These strategies are meant to guarantee that your plates remain compact, and element count is increased to a greater density of systems into a single panel. Not all circuits need HDI designing approaches for a myriad of purposes, whereas certain parts require HDI approaches for effective routing.

An HDI board needs smaller vias to achieve layer transformations, especially for BGA great devices and more lines per mm2. For exemplary pitch modules, the following common characteristics are included in an HDI structure:


Ø Smaller vias:

For layer changeover, HDI boards typically employ microvias or laser-bound, delusional, and stagger vias. Such pathways have a lower refresh rate than usual pathways. Their widths are lower, and their practical depth is consequently limited to employ these Vias using fine-tuning components.

Ø Diluted traces:

The smaller trails used in HDI panels are necessary to link the vias on every layer and the in-pad vias. These smaller traces permit increased trace frequency, the name HDI.

Ø Count of higher layer:

the constructed of non-HDI panels with large layer numbers, but when dealing with high pin frequency electronics, HDI layer numbers may quickly exceed 20 may be more layers.

Ø Lower levels of signal:

For high frequency or high tides, HDI circuits are not utilized. The elevated field strength between adjoining lines causes ESDs, and high tides create an excessive increase in conductive temperature.

Looking at the above criteria and IPC requirements, you may determine whether a board is transitioning to the HDI system, which requires HDI design and routing technology. The current permissible aspect ratio for through-the-hole vias is 8:2 as per IPC-2321A/IPC-2422 regulations (aperture = via detail diameter). This indicates that the lowest drill diameter for a cross hole through a normal thickness of 1,56 mm PCB amounts to 0,197 mm or ~8 miles. As your Via has to be shorter to enable fine pitch parts, certain HDI specialized modules must be used through layouts and smaller traces.

HDI PCB advantages:

The virtual world becomes sophisticated day by day, while the hardware involved becomes much smaller. There are various benefits of HDI PCBs, beginning with greater connectors in smaller regions. As a consequence, boards may be miniaturized in diverse fields.

Your devices are not hefty anymore. They’re smart and attractive. You can operate on your notebook and keep your company going on a trip. You may also view your smartphone’s favorite action film, some quite strong compared to your computers. Or you may connect in and then get into the rhythm with your wireless earbuds. The human race loves technology, and it has become a part of everyone’s life. All electrical equipment was built for mobility at this time. Electronic gadgets for recreation purposes are developed. All this was feasible because the parts and PCBs within the electronic gadgets were miniaturized.

In developing all electrical devices, the PCB sector plays a vital role. Maybe this will be a pacemaker or chipset at a software’s workstation; PCB allowed the creation of critical digital equipment.

1.   Fantastic flexibility:

HDI circuits are appropriate for those who focus on weight, economy, dependability, and efficiency.

2.   Easy installation:

The integration of blind visas and MicroVAX reduces the space need.

3.   Better integrity of signal:

HDI includes technology through inside and blind. This helps to bring the circuits closer together, which reduces the length of the signal route. The HDI feature reduces through stubs and decreases signal distortions, and improves system performance. It enhances the signal integrity considerably owing to shorter signal routes.

4.   Signal Credibility:

Stubs and their impact on signals and data transmission rate reduction

5.   High certainty:

Stacked visas give these panels fantastic protection against harsh environments.

6.   Cost-effective:

The capability of a normal 8-layer PCB may be lowered without losing quality to work in a real HDI board.

Why using HDI:

HDI boards are particularly attractive to portable, mobile, and portable electronics due to their slim, dependable performance and tiny size. These heavier, small molecules and extra transistors interact with the layout of and improve skills to increase the performance of the Printed Circuit Board and the finished result for which it is employed.

Electrical signals require reduced time to travel with equipment closer to one side. The elevated design of HDI panels decreases the signal increases and the capacitance, reducing the impact on surrounding pins and pipes. Additional circuits provide not only an improved user experience but also greater performance.

Focusing on HDI architecture reduces the time and expense of growing prototypes, shortens lead times, and provides a substantial cost advantage.

o   Automotive:

Automobile makers are very attracted by compact PCBs because they can also save room in the car. The merging of technological gadgets to create better driving dynamics was the emphasis of carmakers on future automobiles from firms like Tesla.

o   Medicare:

The HDI PCB influences the medical sector. Medical equipment is frequently HDI since it can integrate into compact devices such as implants, laboratories, and imagery. Medical devices play a key part in illness diagnosis and support life. Ex: defibrillators, patient monitoring equipment.

The inside section of the patients may be viewed, and the correct diagnosis may be obtained using the tiny camera dimensions. The cameras are becoming smaller, yet the quality of the image is not affected. The HDI PCB was developed to enable these advances to be accommodated.

The sensors that have to be placed from equal angles, which some people consider discouraging, have decreased in size with a higher quality of images. Doing a colonoscopy will no longer hurt a lot.

Tablets and smartphones:

All cellphones are ELIC-built HDI PCBs (Each Layer Connectivity). Smaller transportable electronic gadgets are responsible for generating thinner HDI PCBs.

o   Aerospace and military:

HDI is included in secure systems and other critical equipment such as missiles and defensive systems. The HDI PCBs are appropriate for severe and dangerous settings, making them perfect for aircraft and medical operations.

o   Wearable devices:

HDI has become a key consumer player by launching Apple Watch and other accessories such as VR headsets. Digital devices have become popular with the youthful generation because of their outstanding utility.

HDI board types:

A range of vertical goods includes HDI boards, such as missile guidance makers and essential devices and diagnostic devices. The lightweight of HDI panels is also excellent for the aerospace industry and smaller laptops and smartphones.

These are some renowned circuit boards of HDI manufactured.

  • Using surface-to-surface vias
  • Confluence through vias and entered vias
  • Multiple layers of HDI contained through
  • A passive substratum without electronic components
  • Coreless design by using layer sets
  • Alternate coreless buildings by using layer groups

Final Thoughts

HDI circuits are appropriate and preferable for most applications relating to aviation, consumer items, electronic components. Due to its powerful connection of stacked vias, HDI boards with many layers provide greater durability even in intensive environments.

The decrease in pressure gradient creates more room for designers to work, opening up the bare PCB to both edges for design. More closely located smaller components generate greater interfaces, enabling faster communication capability and a significant decrease in bridging delays and loss of signal.

The HDI model enables the 8-layer hollow Printed Circuit Board to be reduced to a 4-layer HDI microplate, with fewer layers capable of providing the same or superior performance. This decrease significantly reduces material prices, making HDI innovation for electronics makers more economic. The higher efficiency of micro HDI PCBs makes them dependable even in demanding settings.

At PNC, you will get your HDI circuits done at an affordable rate. Contact us at sales@pnconline.com.

ICT Testing VS Flying Probe Testing - PCB Assembly

ICT Testing VS Flying Probe Testing – PCB Assembly

PCB Assembly
PCB Assembly

Flying Probe testing and In-Circuit Testing (ICT) are excellent choices for testing the quality of circuit board construction. Both tests detect the expected problems before the circuit board gets into mass production and assemblage. Both tests are a fantastic way of assessing your end product.

Testing of Circuit Boards:

PCBs are getting progressively advanced to fulfill the technical requirements of our digital era. Automatized testing of a board before the mass manufacture permits you to find out faults before mass manufacturing. In-Circuit Testing (ICT) and Flying Probe Testing can assist you in finding out these fundamental issues in the examining process:

  • Bonding Problems
  • Lamination
  • Copper Quality
  • Hole Wall Reliability
  • Electric conduction
  • Electrical resistance To Environmental Factors

In-Circuit Testing (ICT):

In-Circuit Testing equipment can find out 98% of PC Board constructing problems and is among the most best-selling options. It functions by placing the electric circuit board on the mend with a series of investigations to examine the different characteristics of the circuit board. It cannot just check for constructing defects but also operation functionality.

In-Circuit Testing is an effective instrument for PCB testing. It applies a bed of nails in-circuit examination equipment to approach the circuit knobs of a circuit board and determine the performance of every part. It can also test a few functionalities of digital laps, though the complexity attached can make it economically preventative.

In-Circuit Testing is most appropriate for testing productions that are more highly developed and high-volume. All the same, the up-front prices and growth lead time with IC testing are more advanced and more durable, respectively, than those of flying probe testing (FPT). This is as your producer must expressly create a customized IC testing fixture for every PCB.

The bang-up thing with IC testing is that after the instrument is formulated, costs per unit incline to be more down than with flying probe testing (FPT) as it entirely takes approximately 1 minute for a single test cycle. Flying probe testing (FPT), it can take up to 15 minutes per circuit board.

Flying Probe Testing (FPT):

Flying Probe tests (FPT) are some of the times known as “fixtureless in-circuit tests.” They yet utilize probes to try out lineaments on the PCB, but rather than a fixture, the investigations run to the test dots thru a programmed software system. Hence the examination “aviates” where it is required. This choice is most beneficial for low-volume and PCBs yet in maturation because of its versatility.

Contrary to an IC Testing machine, Flying Probe Testing (FPT) does not use a bed of nails mend. As an alternative, it utilizes a small quantity of portable and fixed probes to make a well synchronic in-circuit test of the big top and bottommost of your Printed Circuit Board. It is manufactured of high-precision goads — a few machines utilize as a couple of as 4 goads, although others can use as much as 20 per PCB side. They are programmed to adjoin component pins and execute electrical and operational tests to check if the circuit board is sound for the field.

Flying Probe Testing (FPT) is most appropriate for products that are in the immature stages of evolution and are low-volume grades. It needs no traditional tooling, and customization for each PCB is followed through programming utilizing the CAD data files you provided to the maker. With flying probe testing (FPT), costs-per-unit are more advanced equated to in-circuit testing because of more elongated test round periods per board (about 15 minutes)

In-Circuit Testing vs. Flying Probe Testing:

They both are good in their way, but they both have slightly different properties for testing circuit boards. In-circuit testing vs. flying probe testing depends on the following factors.

  1. Product pattern:

An effective quality test program (also recognized as adequate ‘coverage’) will count the choice of your Computer-Aided Design (CAD) data files and schematic drawings.

The CAD information file is utilized to bring forth the standard test program, which assures that data is sourced from the master design instead of any blue-collar interpretation of additional data. Good choice of populated and unpopulated sample PCBAs are essential for calibrating the test programs, ‘debugging,’ and creating any mends, so the assemblages physically accommodate as they were specified. Therefore thinking about product pattern for a bit, what are the main differences between each examination solution you might prefer to keep in mind?

  • In-circuit testing will need at least a 50 thou broad test pad per net, which has been organized into the PCB direct and utilized to aim for the determined test investigation. Double-sided mends can be expensive, so these had better, ideally, be on the same side entirely of the PCB.
  • Like those proposed by some other companies, flying probe testing machines can examine the ends of parts, pads, and exposed vias to get an approach to the electric network mesh.
  1. Coverage:

As we discuss ‘coverage,’ we look up to how much of the electric circuit you are competent to test. Both in-circuit testing and flying probe testing follow out what is known as a ‘manufacturing defects analysis’ or MDA, which permits the absolute majority of the most mutual process defects that are expected to fall out. These can let in: open electric circuit (due to depleted or defective soldering), short electrical circuits, resistless component measurements (resistances and electrical condensers), junction rectifier and electronic transistor orientation, and standard supply electric potential measurements. , given that these components are mutual to both testing programs, what puts them apart?

  • In-circuit testing can also provide restricted analog and digital measuring, which flying probe testing cannot due to the restricted number of investigations.
  • In addition to the vector-less examination, ICs that are integrated circuits can include a few powered (albeit familiar) operational testing to ascertain the soldering of flags to the PCB Assembly by a non-contact capacitive investigating or plate. In many cases, flying probe testing is restricted to just vector-less tests.
  • Almost all flying probe testing systems will propose a few forms of restricted optical inspection, which adds up coverage for those factors that cannot get at electrically. In-circuit testing mends usually will not offer the choice of optic inspection.
  1. Cost:

The programming cost will hinge upon the complexity of the assemblage but is generally as-is for either test result, potentially about £2000 more or less. As it comes to additional charges affiliated with the test, all the same, there are a few significant differences to have in mind:

  • The fixture prices of flying probe testing are typically zero, but in-circuit testing mends, in contrast, can flow to an extra of about £4000.
  • The evolution lead time for the flying probe testing is generally less than 7 days, but in-circuit testing can have up to 6 weeks for mending, construct, and programming.
  • In the consequence that your product pattern alters in any case, it will just need a program alteration. In the case of in-circuit testing, it could quickly require a new mending if any part or examine pads have been affected.
  • The actual machine test time is generally less than 60 seconds, which signifies that it is perfect for working promptly through bigger batches. At the same time, flying probe testing can accept a lot of minutes, which intends that it is often more suitable for little sets.
  • The velocity of in-circuit testing also means that it is comparatively cheap, frequently coming in at lowers than £1 per unit. Whereas flying probe testing is a somewhat more tedious process, and so can cost about £50, or more, per assemblage.

Final Words:

On the whole, the option between In-Circuit Testing and Flying Probe Testing will hinge upon many essential components of your project. Mainly these include:

  • Anticipated masses
  • PCB pattern/complexity
  • Budget
  • Lead evolution times

While making the PCB contract with the manufacturer, you should have a perfect understanding of every test system, which will only be better for your particular needs. For more small-scale circuit boards that do not need a lot of examination or circuit boards acquired in low masses, the flying probe testing system might be the most beneficial option. On the other hand, enormous groups of circuit boards and composite boards will require the velocity and extended capacities of in-circuit testing.

Frequently, printed circuit boards manufacturers will practice a combination of both testing systems to present you with the most effective results. As flying probe testing will be utilized for standard testing during the image stage of the circuit board development, so will transition the volume of the testing system to the In-circuit testing system for the entire production.

Merely by keeping in mind the expected benefits and the basses of the in-circuit testing vs. flying probe testing, is difference between the two programs, you should experience a much better ordered to choose the best testing scheme for your PCBA assemblage and both testing services are available at PNC.

Contact us at sales@pnconline.com to fulfill your customized testing requirements.