Differences Between IC and a PC Board

Before discussing the IC, you must know what PCB is. The PC Board or PCB has electronic components to help a device function. All digital and electronic devices have PCBs, like consumer products, smartphones, computers, laptops, tabs, etc. The purpose of the PCB is to eliminate assembly issues and have less wiring, enhancing automation and production.
The PCB has different types in terms of the number of layers. Like, it is either a single layer, double layer, four or six layers, or a multilayer circuit board. Now, we will discuss the difference between PCB and integrated circuits.

What Is IC Or Integrated Circuit Board?

The integration of chips makes an integrated circuit, like chips used in a CPU and motherboard are ICs or integrated circuits. Initially, IC was called an integrated block. You will see the IC soldered on a printed circuit board. In other words, a printed circuit board carries the integrated circuit.
The purpose of the integrated circuit or IC is to integrate an ordinary circuit into a chip. So, if the IC gets damaged, the chip won’t work. But, if the PCB gets damaged, you can replace the components.

Printed Circuit Board and Its Components

PCB has different types, however, today’s circuit board has specific components, such as:
Layout and Circuit: PCB circuit is a tool for conducting between different components. A copper surface becomes the base and power layer. Besides, it involves routing through drawing.
Dielectric Layer In The Board: it is also known as the substrate that contains insulation that lies between the layers and a circuit.
Through-Hole Via: vias are made for conducting and a through-hole via helps multiple layers conduct. The plug-in of a device is a large through-hole. There is also a non-through-hole that helps in surface mounting and fixes screws while PCB assembly.
Solder Mask: The copper surface is not always tinned. Epoxy resin is used to print the non-tinned area to separate the tinned copper to prevent a short circuit. Solder mask has different colors, including black, green, red blue, etc.
Silkscreen or Marking: Silkscreen is used to make legends or mark names and locations of different components. It helps maintain a PCB after assembly.
Finishing: the copper surface has to be tinned or it would get oxidized. The surface finish involves different processes, such as ENIG, HASL, immersion tin or silver, and OSP. You can use any method according to your needs as each finishing method has some pros and cons.

Features of Advanced PCB

High-Density PCB’s
PCB is becoming advanced due to new technology. You will see the HDI circuit boards in all small gadgets. Both installation and ICs are also improving with time.
More reliable
Now, PCB is more reliable than before because we have better testing tools. Moreover, its manufacturing and the end product are of high quality.
Up To Parameters
Each PCB material has certain mechanical, electrical, physical, and chemical properties. You will get a high-performing PCB if its design is according to the standards and design parameters.
Better PCB Production
PCB production has also increased with time due to better tools, design software, and advanced technology. Various standards ensure a high-quality device, such as automation, standardization, management, etc. You will see better equipment to test your PCB to have a high-quality end product.
PC Board Assembly
Assembly has also improved and helps you to have more production than the previous years. Similarly, you can develop complete equipment by assembling different components.
PCB Maintenance
PCB maintenance is also essential, especially, if the assembly gets issues. You can easily replace the damaged parts, restoring the system. Making lightweight, and mini or smart PCB is also easier than before. You can have a device with high-speed signals by maintaining your circuit board.

Features of Integrated Circuit

The integrated circuits were developed by Jack Kilby and Robert Noyce. The integrated circuit is very common in certain industries, such as military, civil electronics, television, communication, radio recorder, computer, etc. It provides the following benefits.

• Lightweight structure
• Less lead
• Small volume
• Solder joint
• More reliability
• Longer lifespan
• High performance
• Mass production
• Low cost

IC is a microelectronic component or device in a PCB. IC technology involves the manufacturing of chips, design technology, processing technology, testing, packaging, design innovation, and mass production.
The integrated circuit is a key part of advanced electronic sand it is the heart of many circuits. You will see at least one chip or IC in every electronic device. IC is a combination of various electronic components, including capacitors, resistors, transistors, etc. These components together make a small chip and are linked to having a common goal. There are different types of ICs, such as

• Single-circuit logic gates
• Voltage regulators
• Open amps
• Motor controllers
• 555 timers
• Microprocessors
• Microcontrollers
• FPGAs
• Many others

There is a complex process of making layers of copper, semiconductor wafers, and several other materials. These materials interconnect to make resistors, transistors, and other parts of a circuit.
Not only IC is too small, but it has very thin copper layers and semiconductor wafers. The layers have very delicate connections. Similarly, The IC die is a very small circuit that is too tiny to connect or solder, so you have to package the die that converts the delicate die into a black chip that you often see.
You can enhance the working life of equipment by using the IC to assemble different electronic tools. It helps you to increase the assembly density many times compared to transistors.
These days, you would see silicon ICs involving semiconductors. So, IC is a device that integrates capacitors, resistors, semiconductors, and other elements that make a circuit perform certain tasks. The device connects wires between these components on the silicon wafer through oxidation, diffusion, aluminum evaporation, epitaxy, and photolithography, and then it is welded in a casing or shell.

What Is IC Package?

IC package helps convert a die into a device to have a connection. Die’s outer connection has a small gold wire to a pad on the package that helps to connect it. The pad or pin is silver and it is an extruded terminal on the IC that continues to connect to a circuit’s outer parts. There are different types of IC packages having different dimensions, installation methods, and a number of pins.
Understanding Pin Numbering and Polarity Marking
You should know that every IC is polarized and each pin is different in its function and location. So, the package must show each pin’s nature and function. Mostly the ICs have DOT or Notch to differentiate the first pin. Like, sometimes only one pin is the first or sometimes both are.
Package Mounting
The mounting of a package on a PCB also varies, it can be SMT or surface mount, SMD, or a through-hole mounting. The through-hole package is often large and easy to manage, and it is created to get stuck through a board’s one side and soldering the other side.
The surface mount package has different sizes, small or minuscule. These packages are created to be soldered to the PCB surface and sit on one side. The SMD package has pins either perpendicular to the chip or extruded out the side, or set in a matrix on a chip’s lower part. Such ICs are hard to assemble with hands and need special tools for this purpose.
Dual In-Line Package or DIP
DIP is an ordinary through-hole IC package having two parallel lines of pins that extend perpendicularly from a black, and rectangular plastic casing.
SMT, SMD, or Surface Mount Package
There are many types of SMT packages and in the case of ICs, you must have a custom PCB having compatible copper patterns to be soldered. You need special automated tools to solder the SMD package.
SOP or Small Outline Package
The SOIC package is the SMT cousin of the DIP as this is what you see when you bend all the pins outward on a DIP, reducing the size. The SOP package is very easy to solder with hands. The spacing between the pins should be 1.27mm or 0.05”.
The shrink small-outline package or SSOP is a small type of SOIC package. Likewise, there are TSOP or thin-small outline packages and TSSOP or thin-shrink small-outline packages.
It is easy to understand the difference between IC and PCB if you know all their features as described above.

Final Thoughts

The integrated circuit is a key part of advanced electronics and it is the heart of many circuits. You will see at least one chip or IC in every electronic device. IC is a combination of various electronic components, including capacitors, resistors, transistors, etc.
The purpose of the integrated circuit or IC is to integrate an ordinary circuit into a chip. So, if the IC gets damaged, the chip won’t work. But, if the PCB gets damaged, you can replace the components. However, PCB and IC work together to help an electronic device function.
Would like to know more about the ICs, PCBs or pcb assembly? Email us at sales@pnconline.com

Written by Sam Sangani

Sam Sangani is the President & CEO of PNC Inc., a Nutley, NJ based Printed Circuit Board manufacturer. Sam graduated from L. D. Engineering College with a BS Degree in Mechanical Engineering. He also continued his education and graduated from Steven’s Institute of Technology where he acquired a Master’s degree in Computer Science.

After completion of his BS, Sam worked as a QC Manager, for Xerox, Romania and London. He was responsible for the Quality Control of Cable and Wire Harness imports from Romania. After completing his Master’s Degree, he worked as a Senior Programmer with IBM, Tucson, Arizona. Sam was responsible for leading the Mainframe System Programming Team.

In 1997, Sam acquired PNC INC., a Nutley, NJ based PC Board fabrication Shop. From 1997-2013, Sam has made tremendous improvements and changes within PNC INC., as he added many new Products and Technologies in PNC’s portfolio. With his proven track record and leadership, PNC has never had an unprofitable year and has continued its growth yearly since 1997.

His current responsibilities are Strategic Planning, Corporate Management, New Business Ventures, Sales & Marketing, Trade Shows, Professional Services and leading productive teams to achieve peak potential. He has also utilized Lean Management techniques which have built a foundation for PNC’s high-paced growth. Sam also enjoys real-estate investing, web design & SEO, trading stocks, options, futures and Forex markets.