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PC Board Debugging & Troubleshoot Guidelines

PC Board Debugging & Troubleshoot Guidelines

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Engineers have to test the PCB thoroughly to see if it’s functional and fulfills its purpose of design. But, some manufacturers don’t do it which leads to intermittent issues or PCB failure, and such issues are hard to deal with while debugging. Whereas it becomes a disaster if a PCB fails in the field. You can avoid PCB issues by testing it thoroughly, besides it should be built by a good manufacturer. First, you should know the basic troubleshooting methods, so let’s begin.

Basic PCB Troubleshooting and Debugging

PCB of a printed circuit board has copper traces and insulators to connect heavy components to develop an advanced circuit. It is a great challenge to troubleshoot a circuit board in terms of thickness, size, signals, layers, and the types of different components as they are all very important.
Some circuit boards are simple and don’t need a deep inspection, but there are also complex PCB designs that need special tools for troubleshooting. Generally, the basic test is easy to do through ordinary equipment to assess the currents, traces, and signals on the PC Board.

Choosing the Right Tools

Simple troubleshooting of a Printed Circuit Board involves a few tools, such as a multimeter which is quite common. But, deep troubleshooting of complex boards depends on high-end tools, especially if the problem is big. Like, you will have to use the oscilloscope, an LCR meter, a logic analyzer, and the power supply to assess a circuit board’s response in terms of function.

A Visual Inspection

Initially, you have to test your circuit board visually to see some obvious issues, such as overheating, overlapping of traces, burnt or damaged components, as well as the missing parts of a PCB. You can detect the burnt components through smell as they are not easy to detect otherwise. PCB components often get burnt due to overheating or excessive current. Sometimes the components bulge due to high temperature or heat which helps you identify the damage, like in the case of electrolytic capacitors.

PC Board Debugging & Troubleshoot Guidelines
PC Board Debugging & Troubleshoot Guidelines

Physical Testing

After visual inspection of your PCB comes the physical testing by applying the power to the board. You can easily find hot spots on the circuit board by touching its surface. So, you don’t need a costly thermographic camera to find heated areas. After finding the hot parts, you should cool them with compressed air to see how PCB components function at low temperatures.

How To Troubleshoot Or Debug A PCB Deeply

Experts use four techniques for PCB tests which come up with both pros and cons. Some common methods are ICT, cable scan, flying probe, and a functional test, so let’s study them one by one.

1: The Flying Probe Technique

This method of PCB troubleshooting involves multiple probes that check the PCB by flying around. Like, there are two to six probes in this case. This technique is ideal for large circuit boards, like backplanes. It is also cheaper than the ICT, and it debugs the pcb assembly issues that occur due to poor solder connections. The flying probe also checks components’ presence and their polarities and different values. It is a simple test and can handle the revisions of a PCB.

Cons of The Flying Probe

The flying probe techniques have some flaws in terms of PCB functionality testing, unlike ICT. The flying probe also works slowly compared to ICT because several probes contact the entire PCB testing points. However, it is ideal for low volume PCBs and its total cost is also lower than other techniques.

2: ICT Or In-Circuit For PCB Troubleshoot

The ICT is a PCB testing technique that involves multiple probes which are also called the bed of nails. In this process, the ICT probes connect with the testing points of the entire PCB to check its circuits to see if the assembly is correct or wrong. Like, it tests the bad solder joints or short circuits.

This method can perform even a deeper test by adding other modules or adapters to it. ICT also tests the overall function of PCB and values of the critical components.

Cons Of ICT

Though ICT is a great tool for PCB testing, it has some disadvantages too. Like, it has costly fixtures ranging from $8000, and they go up to $ 15000. Besides, the cost increases with any changes in the technique.

You can have maximum benefits from ICT if the technician knows the testing software and other tools. ICT is the best method for large volume testing.

3: The CableScan

Another troubleshooting technique is the cablescan, which is ideal for PCBs with several connectors having a complicated interface, like the backplanes. The tester attaches the cablescan with the circuit board and it tests all the pins against each other to evaluate the assembly issues, like a solder opening or shorts.

Cablescan also helps check jumpers’ configuration and quality of the diode, besides, it also accesses the capacitance and resistance.

Cons Of Cablescan

There are some flaws with cablescan due to its limits. Like, you have to see the size of the connectors it can test in one go. Moreover, it involves an additional cost to create the hardware interface.

You have to get wetting connectors, but their wiring with the system gets delayed due to the cost or other issues. The cablescan technique and its setup take lots of time, depending on the number of connectors and their complexity.

4: Functional Testing Technique

Another essential thing is to see if a PCB is ready to function or not. The functional test consists of test probes, software, and connected cables, and it determines PCB behavior according to design specifications.

The CM can also create the hardware and software or test fixtures to test the PCB function. This process is ideal for simple and small PCB layout designs. The engineers also develop fixtures for a bench test and make a plan to target the assembly issues involving less time and cost to assess the components. The functional test also helps see if the entire circuitry is working as you want. However, you need detailed debugging to find different faults and remove them.

Role of Engineers and Technicians In PCB Troubleshooting

You need experienced people to troubleshoot a PCB, such as engineers and technicians. Besides, these experts should know how to use the testing tools. Like, in the case of ICT, the engineer should know how to test the semiconductor. He should also know the DFT, end-user applications, as well as ICT optimization. The knowledge of hardware and software development is equally important.

When it comes to the cablescan, the troubleshoot company should have a huge inventory of already built connector interfaces. You can reduce the development cost and time by having all resources in hand.

Likewise, the technicians should debug with a flying probe according to the circuit board. In other words, the testing method should be compatible with the PCB design.

Most engineers use the LabView for a functional test, as it works according to the frequencies, variable supply levels, and several other PCB requirements. Such a deep examination of the PCB involves less amount of hardware, unlike surface-level testing.
Both basic and deep troubleshooting methods help you to find the right PCB issues, leading to an effective product by removing those issues.

Frequently Asked Questions

What Is ICT In PCB Troubleshooting?
ICT is a PCB testing technique that involves multiple probes which are also called the bed of nails. The ICT probes connect with the testing points of the entire PCB to check its circuits to see if the assembly is correct or wrong.
What Is The Flying Probe In PCB Debugging?
This method of PCB troubleshooting involves multiple probes that check the PCB by flying around. There are two to six probes in this case. This technique is ideal for large circuit boards, like backplanes. It debugs the assembly issues that occur due to poor solder connections.

What Is The Role Of A Functional Test In PCB?
The functional test consists of test probes, software, and connected cables, and it determines PCB behavior according to design specifications. The functional test also helps see if the entire circuitry is working as you want.
Is Basic Troubleshooting Enough For Circuit Boards?
No, the basic testing involves only visual and physical tests at basic levels. You need deep testing with specific tools, especially for complicated circuits.

Final Thoughts

PCB of a printed circuit board has copper traces and insulators to connect heavy components to develop an advanced circuit. It is a great challenge to troubleshoot a circuit board in terms of thickness, size, signals, layers, and the types of different components as they are all very important.
Some circuit boards are simple and don’t need a deep inspection, but there are also complex PCB designs that need special tools for troubleshooting. Generally, the basic test is easy to do through ordinary equipment to assess the currents, traces, and signals on the PCB. Whereas deep troubleshooting involves different techniques.
Would like to know more about PCB debugging, troubleshooting printed circuit board assembly? Email us at sales@pnconline.com

PCB Design

Possible Problems & Solutions in a PCB Design Process

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Whatever electronic and digital device you have, it depends on a printed circuit board for signals transmission to help it operate. These devices need a well-designed structure and manufacturing, but you have to encounter many issues in this case that we will discuss here.
Any issue in the design of a PCB would cause delays in its manufacturing, so you must know how to avoid them. Similarly, some problems happen before the design that designers can avoid through proper strategies.

PCB Issues before Its Design

The designer should consider certain steps for a successful design, such as project management and its timeline. You should allocate the project resources and time like there should be enough time to edit your design according to the rules. Sometimes the designers miss certain schedules in a hurry, delivering an incomplete design having many errors.
The designer should be an expert in using the latest design tools. You must have a complete library of CAD materials and should also know the basic design rules. Though these steps look minor, they should be in hand before starting a PCB layout. Now, we will discuss some common PC design issues, so let’s begin.

Component Problems

Sometimes the designers choose the wrong components just to speed up the process, but it can affect a circuit board’s effectiveness. Designers often go for an existing circuitry or select an old and familiar library as it’s convenient for them. But, it becomes a problem when such components or parts are not feasible due to their price or they are not available. So, the designers should be well-informed in terms of design libraries and should choose the Printed Circuit Board parts wisely.

Issues with Physical Parameters

The designers often choose familiar things related to materials, board layout, and outline, as well as the stack-up for layers. However, the prices of such materials may change, besides, their availability can also become an issue. Such changes can affect the design rules according to a different substrate. Likewise, the outline of the PCB also changes due to the design and fabrication limits. So, the designer should discuss all design parameters with their manufacturer before designing the layout.

Locating the PCB Components

A PCB has different components and their footprints should be well-placed on a PCB for precise manufacturing, and it’s called the DFM or Design for Manufacturing for a circuit board manufacturer. If you ignore the DFM, it would result in a high-cost and less effective PCB.
There are certain DFM rules to follow in terms of distance between the components and the circuit board’s edges, the distance between different components, and spacing between various features of the board and components.
There should be enough space around the test points to help a circuit board get tested automatically. You should also consider the placement of the parts that get hot as it can result in thermal issues, affecting a PCB’s performance. Moreover, the high-frequency components should be located in such a way as to have powerful signals.

Routing Issues of Traces

Another PCB design issue is regarding the incorrect trace routing. Like, the widths of the traces and their distance should be correct. The designer should discuss these parameters with their manufacturers to have a precise trace width. Moreover, the weight of the copper should also be correct for perfect routing.
At the same time, the designers should input these values into the design rules while working through CAD. By having well-planed rules and design limits, you can avoid issues regarding a controlled impedance or routing. You can also reduce the burning of traces that occurs due to a lack of copper in case of high currents. You can also eliminate poor signals, and poor copper balancing that happens on the layers of a PCB.
Similarly, the issue of the thin high-voltage traces is also there. Sometimes the trace of a circuit board needs a high voltage that a small trace of less width can’t handle. So, you must calculate the trace width through PCB software, like CAD which has a width calculator for PCB traces.
The designer also has to consider the suitable rise in the temperature for certain traces that helps them to evaluate the current capacity of the trace to choose a compatible copper weight
Moreover, you need high-frequency routing for high-speed signals. Trace routing is not an issue in the case of microcontroller PCBs because they do not need high-speed signals. But, the trace paths need attention for the high-frequency circuit boards because of the address bus and external data.

PCB Design
Possible Problems & Solutions in a PCB Design

Ground Planes and Power Issues

Most designers ignore a network that delivers the power and sometimes they don’t even think about it. If you don’t have a well-designed ground, it would result in poor signals with the noise and EMI emissions. So, the designer should focus on these issues with proper planning after discussing them with the manufacturer. You should know the precise configuration and planes’ location in the layer stack of a PC BOARD.
The design of the ground planes is important to avoid the blockage of signals’ return paths. Moreover, you can also control the interference of the ground and analog with each other by considering these points. Both ground and analog are different in terms of circuitry.
The electric devices involve the linear and switching regulators in terms of voltage. There is low energy by linear regulators, but they are less costly and many PCB designers use them for this reason. But, the linear regulators are not easy for low-noise applications that use high power.
Whereas the switching regulators involve more complicated designs than linear regulators. They are effective in terms of energy, but they need a detailed design for a PCB. So, you have to be careful in this case and should follow the datasheet rules strictly.

System Design Issue

A PCB is just a part of a large electronic device having a specific system that a designer has to consider. However, most designers focus on just the design of a circuit board. Such ignorance can cause several issues during the PCB assembly, such as incompatible wires and board connectors, inaccessible human interfaces or switches, and the lack of space for repair or system debugging. So, the electrical engineers should focus on the design of the full system instead of just a circuit board.

Wrong Usage of Decoupling Capacitors

The electrical parts of a circuit board need stable electricity without interruption. The hardware of a PCB involves decoupling capacitors for stable voltage and this decoupling happens on the rail that supplies the power. You must place the decoupling capacitors close to the pin for maximum and stable current to help it pass through the decoupling capacitors before it reaches the pin.
All these issues are technical that affect the hardware of circuit boards. You must solve these issues to have an effective and functioning product or device.

How to Find the Design Resources for PCB

You can avoid or eliminate the above problems by accessing suitable design resources. You can easily find them online from different companies that offer PCB design, manufacturing, and also provide calculators to calculate specific design parameters. Such companies also offer PCB design and manufacturing services other than just guiding you in a PCB design.

Frequently Asked Questions

What Is Meant By PCB?
PCB is an abbreviation of Printed Circuit Board. It is used in electrical devices to provide them with signals or current to operate. Printed circuit boards are used in different industries, including networking, electronics industry, gadgets, aerospace, and much more.
What Is DFM In A PCB?
DFM is Design for Manufacturing which means you have to have a special layout design for a PCB to be manufactured correctly. You will have to face many issues if there is no DFM.
What Are PCB Design Issues?
PCB design involves different issues regarding its components, power supply, routing, design parameters, decoupling of capacitors, layers stuck-up, copper weight, etc.

Final Thoughts

Any issue in the design of a PCB would cause delays in its manufacturing, so you must know how to avoid them. PCB design involves different issues regarding its components, power supply, routing, design parameters, decoupling of capacitors, layers stuck-up, copper weight, etc.
The designer should consider certain steps for a successful PCB design, such as project management and its timeline. You should allocate the project resources and time like there should be enough time to edit your design according to the rules. Sometimes the designers miss certain schedules in a hurry, delivering an incomplete design having many errors.
All these issues are technical that affect the hardware of circuit boards. You must solve these issues to have an effective and functioning product or device. You can avoid or eliminate the above problems by accessing suitable design resources. You can easily find them online from different companies that offer PCB design, manufacturing, and also provide calculators to calculate specific design parameters.
Would like to know more about the PCB design process or PC Board assembly? Email us at sales@pnconline.com

PC Board

Basic PC Board Rules for Successful IoT Design

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The world is becoming smart each day due to IoT, or the Internet of Things. Your life becomes easier when you connect every device to the internet or Wi-Fi. These days there are many smart homes and products which will stay there in the future. The IoT design is a specific area of electronics design that has boosted the PCB industry.
However, the development of a revolutionary design is not so simple even though the IoT devices are smart and seem simple, it is not so. You need a well-designed PCB for such a device. The PCB should have specific components to meet the needs of the smart world.
The IoT design involves rigid-flex circuits with certain challenges and physical interfaces which are not there in ordinary PCBs. You need certain tools for a smart PCB, like PADS, Xpedition, and other such simulation tools.
Now, smart devices are managed through remote apps, however, it is just a little part of the IoT. The technology is working in big industries like agriculture, transport, biomedical, and consumer electronics. It involves wireless technologies, such as Wi-Fi, Bluetooth, and cellular networks. So all such devices need well-designed hardware in the form of PCBs.

Impact of IoT on the PCB Design and Construction

You have to follow certain rules while designing an IoT-based PCB. It involves a precise evaluation and focusing on the power management, sensors, and the wireless connection, and the Printed Circuit Board should be compatible with all these factors. The design of such printed circuit boards is not like the conventional boards.

Which Aspects Influence the IoT PCB

You have to consider the size, layout, signal strength, security, power, and thermal management while designing a smart PCB. Let’s look at all these factors individually.

1: PCB Size

As IoT devices are small, they need tiny components for signal transmission. Manufacturers use MEMS technology to develop modern sensors because they are economical, reliable, and help develop a small layout. Such a board should have well-integrated components, precise placement of the processor and MCU, and the Wi-Fi interface. Besides, the analog areas should be separate from the digital areas.

2: Layout Design

In the case of IoT, the printed circuit board should have multiple layers to enable traces’ routing. Such a PCB has stringent constraints when it comes to EMC or electromagnetic compatibility.
Moreover, high-density components need high-density interconnections or HDI to help reduce the pads’ size and increase the number of vias or holes.

3: Signals Integrity

The PCB should have high-end sensors for precise signals, free from the coupling. The signals should not interfere with the wireless signals and power lines. They should work well in all kinds of operating conditions.

4: PCB Materials

Smart technology and IoT have resulted in innovative materials for developing PCBs, including flexible boards. A flexible PCB is designed after considering the material’s mechanical structure and position of the electric components. You can place many components on a flexible PCB, so it is also suitable for wearable devices.
A flexible PCB has simple wiring than a rigid PCB and it stays strong during mechanical stresses, which are often hard to ignore.

5: Power Management

You have to consider the battery life of the IoT devices, and the power management helps you to enhance the battery function. You must have a well-integrated circuit in terms of power. The circuit should have functional blocks within the power cost or budget.
The designer of the PCB design PCB design should estimate the power consumption in a device’s multiple operating conditions. You must know that the wireless transceivers sometimes come up with absorption peaks while the transition from an Off state to an On state. Besides, considering the power consumption during a battery’s deep sleep mode is also essential because it helps determine the battery function.

6: Security System

Though the internet world has unlimited benefits, you become vulnerable to lots of threats. The IoT involves a shared network, so you cannot escape from attacks without good security. The water, gas, and electricity meters also become unsafe due to IoT devices. Similarly, the electro-medical device is also at risk as it has highly sensitive data.
Security software is not sufficient in this case, so the designer has to consider it while developing any hardware. However, the cryptographic engines provide high-end security through encrypted algorithms, including DESM, AES, as well as SHA.

7: Thermal Management

An IoT device is very small and runs with a battery, and it has a slot-free cover, so it needs proper thermal management. The designer should take care of the hot spots while designing a PCB. These hot areas happen when their temperature gets over 150 °C, but it can be managed through traces geometry, like the width and height ratios. You must provide copper plating to thermal vias and should add the copper planes for thermal management.
The IoT PCB has a limited area, so the designer has to provide the grounding area carefully for proper RF connectivity and heat dissipation. Sometimes the designer focuses on the simulation of the thermal air and provides it through both 2D and 3D models. Whereas, the tools like ECAD and MCAD help in this case.

Some Other Design Considerations

As IoT devices involve wireless connections, they should be certified in terms of RF components. These certificates have different names depending on the country as FCC works in the United States, and Canada has IC. Whereas CE is used in Europe, moreover, some additional certificates are also required, including WEEE and PTCRB, which ensure the standard emission of the radiations.
The certification process becomes easier if you use a pre-certified RF module because you can use it in the device directly, and you don’t have to pay for an expensive certification.
Due to smart solutions, more design tools are emerging for designing the IoT PCB that involves the AMS or analog signals, circuit analysis, simulation, and some models.
The strength of the connections is validated through simulation, so it is essential to consider. Well-designed software can simulate a circuit’s schematic by taking care of various design parameters, like time and frequency domain, operating point, sensitivity, worst conditions, and the Monte Carlo analysis.
The designer also has to consider the size, battery life, charging time, and power usage in the case of wearable devices.

IoT PCB Development

You must focus on the pcb fabrication process and assembly before making it. As a smart device has less space, a flexible PCB works for it because you can bend it as you want without affecting the device.
Besides, the manufacturing tools and equipment should be strong enough to bear vibrations and shocks. Other than a flexible PCB, the designer can use the SiP technology for the simple manufacturing of the IoT PCB. The SiP or System-In Packages help to use a complex analog, RF, and a digital system through a single chip. However, the chip works just like a traditional chip.
The IoT device should have a consistent network connection like the 24/7 operation works in the industrial applications having a 100 % uptime.
Likewise, it is essential for a PCB to have constant power to work consistently. The battery life of the portable devices should be extended for high efficiency.
Whether it’s the PCB design or some other stage of the IoT device development, the verification of the manufacturability of the product is essential. The DFT or Design for Test tool works in this case and helps to find any defect in the PCB before using it.
Likewise, the DFMA analysis helps to detect any issues while PCB designing, and you can resolve them before producing the PCB.
Similarly, you have to consider the security of the IoT devices to avoid any counterfeiting of a PCB that often happens in metrology applications. Manufacturers are now developing advanced technologies to create the IoT PCB. Like, they use the coded IDs for every PCB layer, so it is hard to replicate it.
So, you can create a well-designed and well-assembled IoT PCB by considering important factors.

Final Thoughts

The IoT design involves rigid-flex circuits with certain challenges and physical interfaces which are not there in ordinary PCBs. Smart devices are managed through remote apps, however, it is just a little part of the IoT. The technology is working in big industries like agriculture, transport, biomedical, and consumer electronics.
IoT involves wireless technologies, such as Wi-Fi, Bluetooth, and cellular networks. So all such devices need well-designed hardware in the form of PCBs. You need a well-designed PCB for such a device. The PCB should have specific components to meet the needs of the smart world.
You have to follow certain factors while designing an IoT-based PCB. It involves a precise evaluation and focusing on the power management, sensors, and the wireless connection, and the PCB should be compatible with all these factors.
Would like to know more about PCB design rules or PC Board assembly? Email us at sales@pnconline.com

BGA SMT assembly process

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BGA is an abbreviation for Balls Grid Arrays is a greater surface mounted packaging technique. The connections at the bottom of the packaging were circular and organized in a lattice-like structure, thus the term BGA. At the moment, motherboards controller chipsets employ such manufacturing materials and technologies, primarily earthenware. BGA technology, when combined with storage packaging, allows you to produce the same size storage while increasing SMT assembly processing capability by two to three times. BGA has a smaller frame and superior thermal conductivity qualities. BGA production process has substantially enhanced every square inch of memory; employing BGA manufacturing solutions, memory devices with the same capacity require just one-third the dimensions of a standard package; when contrasted with the conventional bundle.

It is a sort of surface-mount packaging (also known as a chip carrier) for interconnected circuitry. BGA modules have been used to install components like microcomputers securely. A BGA can accommodate more connectivity pins than a double inside or flat module. Instead of simply the boundary, the entire bottom area of the gadget may be employed. The connections were also smaller on aggregate than from an outer wall kind, resulting in improved effectiveness at incredible velocities. BGA gadget welding necessitates fine management and is often performed by computerized systems. Socket installation is not possible with BGA electronics.

Connectivity

The fundamental distinction between BGA Lead frame products and traditional SMT Lead frame products is the arrays structure of soldering sectors on the packaging, which suggests different interpretations for connecting communication, voltage, and ground connections on the PCBs.
In general, overall printable circuit boards design and implementation is a critical aspect in obtaining good solder connection durability. It is not suggested, for instance, to position BGA bundles in the very same contrary places here on the Printed Circuit Board (when double-edged mounting has been used), since this results in stiffness of the arrangement and earlier solder combined fatigue, particularly in comparison to a layout in which the element places have been started shifting against one another and.

Pattern for Soldering

Mass production is used to apply solder solution to the PCB metallic pads. The stencil apertures and thicknesses influence the amount of the generated soldering solution. In most circumstances, the thicknesses of a stencil must be adjusted to meet the requirements of all devices just on PCB. This is advised to use 100 – 150 m thickness overlays for BGA modules. The stencils perforations should be circular. The opening dimension must be the same as or slightly larger than the metallic pad thickness on the PCB.
To guarantee consistent and strong soldering paste application to the PCB, laser cut (mainly corrosion-resistant) or programs/projects (Nickel) stencils should be used.

Soldering

Solder paste is made up of soldering alloy and a fluxing system. Typically, the quantity is divided into 50 percent alloy and 50 percent flux. In terms of mass, this equates to around 90percentage alloys and 10percentage fluxes systems. During the resistance spot welding, the fluxes system removes environmental contamination from the soldering connections. The capacity to remove environmental contamination is controlled by the action potentials. The soldering solution metal alloy must be either lead-based austenite or near-eutectic (SnPb or SnPbAg) or lead-free (SnAgCu whereas Ag 3 – 4 percent, Cu 0.5 – 1 percent). Since washing underneath the connected BGA may be problematic, a “no-clean” solder solution was suggested. The solution should be adequate for producing the soldering stencils apertures measurements; Type 3 pasted is suggested for ball pitches of 0.80 mm and 0.65 mm, while Type 4 glue is suggested for ball pitches of 0.5 mm. Soldering paste has age, weather, and moisture dependent. Make sure to follow the pasted company’s treatment instructions.

Placement of Components

BGA packages must be precisely arranged according to their shape. Individually placing the packets is not advised. Sophisticated automated element placement devices with computer vision achieve element positioning levels of accuracy of 50 m. Both PCB, as well as the parts, were visually scanned in these systems, and the parts were put on the PC Board in their predetermined places. These fiducials on the PCB are now either positioned on the PCB’s edge for the whole PCB or particular mounting points (local fiducials). A visual interface detects them instantly before the installation procedure. A sophisticated vision algorithm identifies the packets, allowing for the exact alignment of the full program.

Due to the increased surface pressure of the soldering, packets with conductive spheres as the BGA have had the advantage of self-alignment during the reflow process if they have been significantly misaligned. As a rule of the thumb, the maximum allowable element movement equals 30% of the metallic pads thickness just on PCB (for non-solder mask defined pads). As a result, for BGA modules, the soldering contact to PCB pads mismatch must be higher than 150 m (higher than 100 m for spacing 0.5 mm) to provide a strong installation procedure. This is often possible with a broad variety of finding the most appropriate.

The subsequent statements stand necessary:

  • Particularly on big boards, localized fiducials near to the gadget might mitigate a substantial number of PCB limitations.
  • It is advised that you utilize the positioning system’s ball identification abilities rather than the outlining centered. This removes the program’s soldering ball to packaging edge limitations.
  • Effective illumination and the right selection of measurement modes are required to guarantee the visual state’s recognition of the items. The precise parameters may be obtained from the device instructions.
  • Excessive insertion force might result in pushed-up soldering paste and solder junction failures.

Solder joints

To a considerable degree, soldering influences the production and accuracy of component manufacturing. In principle, all typical reflow soldered procedures are applicable.

  • compelled circulation
  • during the gaseous stage
  • far-infrared (with restrictions)

The specified temperature patterns were suited for BGA board manufacturing. During the soldering procedure, each soldered joint must be subjected to temps beyond the soldering solubility limit for a good amount of time to get the best soldering joint integrity, while overheating the PCB and its elements must be prevented. For the highest product normal temperature, please see the barcode scanner labeling on the packaging.
Special attention may be required when utilizing ultraviolet ovens lacking ventilation to ensure suitably uniform temperatures profiles for all solder connections on the PCB, particularly on big, complicated boards with varied heating capacities of the elements, particularly with someone underneath the BGA. Forced convective routing protocol has been the most commonly suggested kind. Although a nitrous environment can increase solder connection quality generally, it is usually not required for solder tin-lead metal alloys.

Gathering on Both Sides

In principle, BGA packages are ideal for installation on double-sided PCBs. Be cautious that items with a high weight may fall off throughout the final soldering process procedure when facing down during the PC Board assembly. In such circumstances, the packages must be constructed during the final (= second) reflow procedure. A weight restriction of 0.2 g/mm2 soldering surface (NSMD pad) might be considered as a rule of thumb. Whether boxes are impacted is determined not just by mass, but also by vibration and air draught in the heating chamber.

Solder Alloys Interoperability

Because various solder alloys may be used for packaging spheres or bumping and soldering paste placed just on PCB, the interoperability of these compositions must be considered.

The benefits of BGA boards

Dense population

A BGA solves the difficulty of making a tiny packaging for a semiconductor technology with thousands of connections. Pin grids displays and dual-in-line surfaces mounted (SOIC) modules were being manufactured with an increasing number of connections and reducing distance amongst the connections, but this was producing problems with the soldered procedure. The risk of inadvertently crossing neighboring connections using soldering increased as packaging pins became closer apart. If the soldering is put to the packaging at the manufacturer, BGAs don’t have this issue.

Convection of heat

The decreased temperature difference across the container and the PCB is another benefit of BGA packaging over packaging with separate connections (i.e. boxes with legs). This permits heat produced by the semiconductor technology on the inside of the packages to transfer more freely to the PCB, reducing overheating of the chip.

Connections with low capacitance

The smaller the undesired capacitance of an electromagnetic wire, which causes signal distortions in high-speed electromechanical equipment, the smaller it is. Because of the slight distance between the packaging and the PCB, BGAs have consistently low inductors and so outperform pinning gadgets in terms of electromagnetic efficiency.

Problems with BGAs throughout PCB manufacturing

While research, soldering BGAs into place is impractical, therefore sockets are utilized instead, however, they are unstable. There seem to be two main types of sockets: the more dependable version features springtime pins that force up beneath the balls, but it doesn’t permit for the use of BGAs with both the balls detached since the springs pins might have been too shorter.

Interested to know more about BGAs or pcb assembly services? Email PNC at sales@pnconline.com

Why printed circuit board manufacturers use plated slots ?

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Printed Circuit Board Plated Slots

Slots are holes, which are either plated or non- plated-through. So, plated slots are holes plated in copper. And we use them for electrical connections on the PCB. A through slot is the one that goes to the entire depth of the board, starting from one end to another. Whereas a PCB outline or edge also has plating called side plating.

printed circuit board manufacturers use plated slots for components packaging, however, non-plated slots are also in practice. But, PCB with multiple layers have only plated-through slots.

Why Prefer Plated Slots?

PCB assembly involves different designs and components, and you would often see round holes to accommodate the round components or square as well. A round hole suits a PCB with through-holes. However, certain components are compatible with the blade or rectangular leads, so the round or square holes are not ideal in that case, and this is where a plated slot works.

When the pin size becomes large, the rectangular connectors work with plated-through slots rather than round holes. Like, they are ideal for the DC Jacks. Though you can use the round holes for small connectors and rectangular pins, plated slots are better because they take less space on the PCB, unlike the round holes.

Difference between Plated And Non-Plated Slots

Plated slots have copper plating in the circuit layer, whereas it opens in the solder mask.
On the other hand, non-plated slots don’t have copper plating in the circuit layer, besides, it does not open in the solder mask.

Design of Plated Slots

There is a specific way to show plated holes on the Gerber, like:

    • You have to put the copper pads on the upper and lower solder mask.
    • Then you insert a milling slot in the mechanical layer.

Designers prefer a mechanical layer to put slots in the Gerber and it involves two possible options to do it.;

Use of Flashes Having the Right Size Slot

Drawing a slot with a 0.50 mm thick line, as it helps designers to check it visually to ensure that there is enough tolerance between copper and the PCB edge. Remember that a line’s center is considered the edge of the slot.

Then you have to join the slots with the PCB outline into the Gerber, and it should be parallel to the copper layer. However, the copper layer should also have a PC Board outline to stay on the safer side.
The mechanical layer in this case has different names, depending on the system. It also depends on milling as it should be there. However, you can use another layer in the absence of a mechanical layer. Use the README file to avoid any doubts regarding the right file.

Don’t always define slots in a legend or a copper layer because they could be misinterpreted. Show large slots in the legend or copper layer, however, the outline should be precise. Don’t forget to write the text SLOT in the center.

Creating a Drill File

You can also define the plated slots through drill files as it is a precise way, however not all CAD software allows this option. But, defining through the drill files involves the X and Y or the slot width and length, instead of a complete row of holes that overlap.

Understanding A Small Slot In The PCB

The size of the smallest slot varies, depending on the type of the PCB, like if it’s flex, rigid, or rigid-flex. The width of the smallest slot is 0.50 mm for a rigid and flex-rigid PCB, and the length is often 1.0 mm.

These sizes are so due to more thickness of the PCB, besides, the slots are created through the NC milling that is mechanical. As, the grooving cutter of NC is 0.50 mm and its length is twice the width, like 1.0 mm.

On the other hand, the thickness of the flex PCB is less, and you can make slots through a laser machine. Designers prefer the smallest slot because the bigger slot’s length becomes more which is twice its width.

Milling Of the Cutouts Or Slots

You have to use the round NC grooving bit for the milling of slots in the rigid PCB, and it’s just like the CNC machine. However, the inner corners of the slots are made round instead of sharp. Whereas the PCB edge is created to the center of the border.

Which Industries Can Use the Plated Slots?

Mostly the thick or multilayer PCBs have plated slots, and such boards are ideal for different industries, including aerospace, consumer electronics, computer, and telecommunications. As these slots don’t take much space, they are cost-effective in terms of making. A board with both plated slots and round slots is also ideal for multiple electrical connections.

Frequently Asked Questions

What Is A PCB?

PCB stands for a printed circuit board having different electrical components, holes, and other features. Various industries use PCB boards to provide the electrical signals to run different devices or electronics. A PCB board can be embedded, single or double-layered, or can have many layers like up to 60 plus.

What Is The Definition Of A Plated Slot?

A plated slot is a hole in the PCB with copper plating. It is not round, so it is ideal to accommodate the leads with rectangular pins. You can use such a slot for electrical connections and component packaging
The slot goes throughout the circuit board that’s why we call it a plated-through slot.

What Is Edge Plating?

If plating is done on the edges of a PCB, we call it edge plating. Besides, you can also call it the side plating of a circuit board. It goes from the upper layer to the lower layer of the PCB, extending to an edge of the perimeter.

Which Circuit Board Should Have Plated Slots?

Generally, the multilayered PCBs have slots with plating also known as plated-through slots. However, there are also non-plated slots, depending on the PCB design and its application.

Do I Need A Lot Of Space For Plated-Through Slots?

Plated slots are mostly rectangular, hence they don’t take much space on the PCB like the round slots. So, such slots are ideal when you run short of space on the PCB, and where you need to use the rectangular Jacks.

What is a Copper Layer?

PCB has different layers of which one is a lamination made of copper foil, and it is attached to the circuit board with some adhesive. The copper layer is essential for a two-sided PCB, including copper on both sides. But, PCB boards with more than 60 layers of copper are available by different companies.

What is Solder Mask Layer?

The green color on the circuit board is a solder mask and its surface is called the solder mask layer. The purpose of the solder mask is to cover the exposed copper to prevent users from the electric shock upon contact. Though it is mostly green, other colors are also available.

Final Thoughts

PCB manufacturers use plate slots for components packaging, however, the non-plated slots are also in practice. But, PCB with multiple layers has only the plated-through slots. Certain components are compatible with the blade or rectangular leads, so the round or square holes are not ideal in that case. This is where a plated slot works.

Plated slots have copper plating in the circuit layer, whereas it opens in the solder mask. Non-plated slots don’t have copper plating in the circuit layer, besides it does not open in the solder mask.

The size of the smallest slot varies, depending on the type of PCB, like if it’s flex, rigid, or rigid-flex. The width of the smallest slot is 0.50mm for rigid and rigid-flex PCB and the length is often 1.0 mm. Engineers use cad software to make Gerber files for different types of slots including plated through and non-plated through slots.

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