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What are IPC standards for PCB Design, PCB Assembly and PCB Fabrication?
IPC standards are electronic design, manufacturing and inspection standards published by IPC, a global trade and standards setting association focused on the electronics industry. IPC’s standards are used worldwide and have been essential to the globalization of the electronics industry. Anyone who designs or manufactures PCB assemblies needs to be familiar with the standards. Most engineers and designers first encounter the IPCstandards in the fabrication notes on PCB drawings or because they have been trained on ubiquitous IPC-A-610 “Acceptability of Electronic Assemblies” which illustrates quality standards for PCB soldering and cleaning. The IPC publishes standards for every aspect of PCB design [1], ...
PNC’s step by step guide to PCB Design component placement
A schematic is an abstraction, a representation of an ideal circuit. A PCB Assembly [1], on the other hand, is a complex mechanical assembly. All the components in the circuit design must fit within the physical boundary of the PCB. The designer must locate and place hundreds of components subject both to the mechanical constraints of the product design and the manufacturing process while not introducing electrical noise into the circuit. It can seem overwhelming to someone new to the PCB layout process. Fortunately, there are some simple guidelines used by the designers at PNC that will help break the layout ...
PCB assembly Pre-Reflow FAI
First article inspection (FAI) prior to SMT assembly [1] is a design verification methodology that provides a reported verification and validation of details of a product on the shopfloor per its manufacturing procedure and requirements. There are various ways to perform FAI, from both supplier’s and customer’s side, making it a very dynamic process. This means that each organization can tailor its FAI method to benefit itself and consequently, its customer, yet maintain rigid performance standards at the same time. FAI involves qualitative and quantitative measurement. FAI is also highly effective since it can potentially fulfill process validation requirements of ...
Basics of Solder Paste selection for PCB Assembly
INTRODUCTION Solder pastes are amorphous putty-like soldering materials used to solder surface-mounted components to the Printed Circuit Board. [1] The effect of solder paste on the PCB’s structural and functional integrity is the paramount factor to consider when deciding on selection of solder paste for application. Many factors which contribute towards the strength of the solder joint and its conduction efficiency need to be addressed as well. This is not just a discussion on what measures and precautions to take during PCB assembly and reflow, but also to put into question what a PCB design [2] engineer should consider ...
Accelerate your New Product Development with rapid PCB assembly prototyping
The time from concept to prototype has accelerated remarkably in the past decade. 3D printed prototype components in a wide variety of materials are available in hours. Machined or sheet metal components are available from rapid prototype shops in only one or two days. Prototype Printed Circuit Board Fabrication [1] and assembly companies like PNC have followed this trend towards faster prototypes and can now provide complete assemblies in less time than ever before. PNC can fabricate and deliver a bare 10-12-layer PCB in just three days, and a simple double-sided board in just 24 hours. However, even with the streamlining ...