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What’s a HDI Printed Circuit Board?
HDI stands for High Density Interconnect. HDI PCBs have finer traces and trace spacing, laser drilled micro vias and higher connection pad density. Its two chief advantages are that it permits the use of fine pitch BGAs and it reduces the number of PCB layers required because the finer traces and smaller vias allow more circuitry in a smaller area. Narrow trace widths mean higher circuit density At PNC standard PC Board fabrication [1] uses a minimum trace width of 5 mil, with a 5 mil space between traces (5/5mil) PNC’s HDI trace widths can be as narrow as 3 mil with ...
Better BGA routing on a Printed Circuit Board with High Density Interconnect
One of the technologies that have allowed electronic products to shrink in size and provide increasingly higher performance is the ball grid array (BGA) IC package. The BGA allows higher density Printed Circuit Board [1] layouts because of simple geometry. The number of pins that can be accommodated on the perimeter of a quad pack increases linearly with package size. The number of connections that can be accommodated on a BGA increases with the square of the package size. BGA packages now routinely exceed 1000 connections, and the ball pitch has shrunk from 1.0 mm to .8 mm to a growing ...