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Embedded software development along with PCB Assembly
No company can excel at every aspect of new product development and trying to do everything can dilute an organization’s focus on the tasks that are essential to its success. For example, most companies have long ago outsourced the PCB design and fabrication steps of new product development. This same need to focus on the essential is true of software development too. It is difficult for a software company to excel at every type of software development because of the ever expanding universe of software languages, operating systems, and architectures. A cloud based SAAS or PC based application is very ...
Minimizing Crosstalk in PC Board Layout
In this ongoing series on PCB layout from the design team at PNC, previous posts have looked at some of the initial steps to turn a circuit schematic into a manufacturable, reliable PCB. These posts have looked at component placement [1], selecting appropriate trace widths [2], and BGA routing [3]. In this post we are going to take a deeper dive into methods for reducing crosstalk in the PCB design [4]. After the power and ground have been routed, the next task is to route high speed signal traces, and the traces that could either generate or receive crosstalk. What is ...
What are IPC standards for PCB Design, PCB Assembly and PCB Fabrication?
IPC standards are electronic design, manufacturing and inspection standards published by IPC, a global trade and standards setting association focused on the electronics industry. IPC’s standards are used worldwide and have been essential to the globalization of the electronics industry. Anyone who designs or manufactures PCB assemblies needs to be familiar with the standards. Most engineers and designers first encounter the IPCstandards in the fabrication notes on PCB drawings or because they have been trained on ubiquitous IPC-A-610 “Acceptability of Electronic Assemblies” which illustrates quality standards for PCB soldering and cleaning. The IPC publishes standards for every aspect of PCB design [1], ...
PCB assembly Pre-Reflow FAI
First article inspection (FAI) prior to SMT assembly [1] is a design verification methodology that provides a reported verification and validation of details of a product on the shopfloor per its manufacturing procedure and requirements. There are various ways to perform FAI, from both supplier’s and customer’s side, making it a very dynamic process. This means that each organization can tailor its FAI method to benefit itself and consequently, its customer, yet maintain rigid performance standards at the same time. FAI involves qualitative and quantitative measurement. FAI is also highly effective since it can potentially fulfill process validation requirements of ...
PRINTED CIRCUIT ASSEMBLY TESTING
No single printed circuit assembly [1] testing system will meet all the requirements of every manufacturing environment. PNC employees the three most commonly used testing methods for defect detection being Functional Test (FCT), In circuit Testing (ICT) and Flying probe testing. Each test method will have different results based on your test strategy. Your testing strategy must be developed with consideration to many factors such as reliability, cost or functionality traits. The key here is to detect defective boards and catch issues prior to end usage. Some considerations like opens, shorts, resistance, capacitance, inductance, diode issues, detecting incorrect component values, ...