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ICT Testing VS Flying Probe Testing – PCB Assembly
[caption id="attachment_632" align="alignleft" width="300"] [1] PCB Assembly[/caption] Flying Probe testing and In-Circuit Testing (ICT) are excellent choices for testing the quality of circuit board construction. Both tests detect the expected problems before the circuit board gets into mass production and assemblage. Both tests are a fantastic way of assessing your end product. Testing of Circuit Boards: PCBs are getting progressively advanced to fulfill the technical requirements of our digital era. Automatized testing of a board before the mass manufacture permits you to find out faults before mass manufacturing. In-Circuit Testing (ICT) and Flying Probe Testing can assist you in finding out these fundamental ...
Selective Soldering for PCB Assembly
A selective soldering approach offers PCB connectors the perfect instrument to overcome a few of the challenges. Selective soldering is a robotic device that pushes hot solder from a tank via a nozzle to cover the conduits running from the ground of a circuitry What is Selective Soldering? Selective soldering is indeed the method of soldering components selectively onto electronic components and formed modules, damaged in conventional printed circuit board assembly [1] or through-holes technology mounting procedures by heat from the heat exchanger or wavelength soldering. This normally involves an SMT refill operation; selectively soldered components are generally surrounded by elements that ...
Importance of Good ESD Practices in SMT Assembly
The management of electrostatic discharge is a crucial feature in the production, assembly, and maintenance of electronic equipment. If electrostatic discharges are not managed, they may destroy an electrical device at any step of its manufacture or use. Grounding any wires that come into touch with or are close to the electrical equipment is the main way of control. Humans, tools, ESD mats, various electronic equipment, boards, connections, packing, and other conductors are among them. Removal of extra insulators, shielding, ionization, pollution regulations, training, awareness, and highest level compliance are all part of a successful ESD management program. What exactly is ...
Embedded software development along with PCB Assembly
No company can excel at every aspect of new product development and trying to do everything can dilute an organization’s focus on the tasks that are essential to its success. For example, most companies have long ago outsourced the PCB design and fabrication steps of new product development. This same need to focus on the essential is true of software development too. It is difficult for a software company to excel at every type of software development because of the ever expanding universe of software languages, operating systems, and architectures. A cloud based SAAS or PC based application is very ...
Minimizing Crosstalk in PC Board Layout
In this ongoing series on PCB layout from the design team at PNC, previous posts have looked at some of the initial steps to turn a circuit schematic into a manufacturable, reliable PCB. These posts have looked at component placement [1], selecting appropriate trace widths [2], and BGA routing [3]. In this post we are going to take a deeper dive into methods for reducing crosstalk in the PCB design [4]. After the power and ground have been routed, the next task is to route high speed signal traces, and the traces that could either generate or receive crosstalk. What is ...