Quote and Order Your PCB's Online, 24/7

Importance of Good ESD Practices in SMT Assembly

The management of electrostatic discharge is a crucial feature in the production, assembly, and maintenance of electronic equipment. If electrostatic discharges are not managed, they may destroy an electrical device at any step of its manufacture or use. Grounding any wires that come into touch with or are close to the electrical equipment is the main way of control. Humans, tools, ESD mats, various electronic equipment, boards, connections, packing, and other conductors are among them. Removal of extra insulators, shielding, ionization, pollution regulations, training, awareness, and highest level compliance are all part of a successful ESD management program. What exactly is ...

Minimizing Crosstalk in PC Board Layout

In this ongoing series on PCB layout from the design team at PNC, previous posts have looked at some of the initial steps to turn a circuit schematic into a manufacturable, reliable PCB. These posts have looked at  component placement [1], selecting appropriate trace widths [2], and BGA routing [3].   In this post we are going to take a deeper dive into methods for reducing crosstalk in the PCB design [4]. After the power and ground have been routed, the next task is to route high speed signal traces, and the traces that could either generate or receive crosstalk.  What is ...

What’s a HDI Printed Circuit Board?

HDI stands for High Density Interconnect. HDI PCBs have finer traces and trace spacing, laser drilled micro vias and higher connection pad density. Its two chief advantages are that it permits the use of fine pitch BGAs and it reduces the number of PCB layers required because the finer traces and smaller vias allow more circuitry in a smaller area. Narrow trace widths mean higher circuit density At PNC standard PC Board fabrication [1] uses a minimum trace width of 5 mil, with a 5 mil space between traces (5/5mil) PNC’s HDI trace widths can be as narrow as 3 mil with ...

Better BGA routing on a Printed Circuit Board with High Density Interconnect

One of the technologies that have allowed electronic products to shrink in size and provide increasingly higher performance is the ball grid array (BGA) IC package. The BGA allows higher density PC Board layouts because of simple geometry. The number of pins that can be accommodated on the perimeter of a quad pack increases linearly with package size. The number of connections that can be accommodated on a BGA increases with the square of the package size. BGA packages now routinely exceed 1000 connections, and the ball pitch has shrunk from 1.0 mm to .8 mm to a growing ...

Printed Circuit Boards

PNC Inc. offers every solution in the PCB arena. This includes design, fabrication, assembly and a number of value-added services. With these capabilities and our facilities around the country, we are able to provide quick-turn prototypes and large-scale production all under the same roof. We pride ourselves on constant improvement and invest millions each year into making sure we have the latest technology to make our processes as efficient as possible.

Contact Adress

  • Location:
    PNC Inc.
    115 East Centre St.
    Nutley, NJ 07110
  • Phone: (973) 284-1600
  • Email:

Share with us

NewsLetter


© 2015 pnconline All right reserved