| Shop Tolerance | Standard | Advanced |
| Minimum Outer Line Width |
.005" |
.003" |
| Minimum Inner Line Width |
.005" |
.003" |
| Minimum Outer Space, Trace / Trace |
.005" |
.003" |
| Minimum Inner Space, Trace / Trace |
.005" |
.003" |
| Minimum Outer Space, Trace / Pad |
.005" |
.003" |
| Minimum Inner Space, Trace / Pad |
.005" |
.003" |
| Minimum Space, PCB Edge to Conductor |
.008" |
.005" |
| Lay-to-Layer Registration |
+/- .005" |
+/- .003" |
| Maximum Finished PCB Thickness |
0.250" |
0.250" |
| Minimum Board Thickness Tolerance |
+/- 10% |
+/- 5% |
| Dimensions - Hole Location |
+/- .001" |
+/- .001" |
| Dimensions - Fab O. D. |
+/- .010" |
+/- .005" |
| Warpage (flatness of finished board) |
0.75% |
0.50% |
| Minimum Component Pitch |
.010" |
.008" |
| Minimum Dielectric Thickness |
.004" |
.003" |
| Maximum Number of Layers |
18 |
40 |
| Pad to Hole | Standard | Advanced |
| Minimum Plated Hole Size |
010" |
.006" |
| Tolerance - Plated Hole Size |
+/- .003" |
+ .002"-.001" |
| Nominal Finished Hole Size |
.012" |
.004" |
| Minimum Outer Non-Plated Hole to Trace Spacing |
.008" |
.004" |
| Minimum Inner Non-Plated Hole to Trace Spacing |
010" |
005" |
| Drilling | Standard | Advanced |
| Minimum Drill Size |
.012" |
.005" |
| Maximum Drille Hole Size (Above .257"is routed) |
.257" |
.257" |
| Minimum Aspect Ratio |
8 |
15 |
| Testing Capabilities | Standard | Advanced |
| Minimum Component Pitch |
.010" |
.008" |
| Volts |
100 Volts |
250 Volts |
| Current |
50mA |
50mA |
| Resistance - Low |
100 ohms |
100 ohms |
| Resistance - High |
10 ohms |
10 ohms |
| Soldermask Criteria | Standard | Advanced |
| SMT Minimum Pad Spacing |
.007" |
.003" |
| Minimum Soldermask Dam |
.006" |
.004" |
| Materials Available | Tg C | DK |
| FR4-04; Standard Multifunctional |
150° |
4.25 - 4.60 |
| FR4-06; High Performance Epoxy Laminated |
170° |
4.29 - 4.60 |
| FR4-08; High Performance, High Speed, High Tg |
180° |
3.7 - 3.8 |
| GETEX |
175-185° |
3.8 - 4.2 |
| Polyimide |
230-260° |
4.2 - 4.6 |
| ISOLA 370HR |
180° |
3.94 - 4.04 |
| Teflon, Rogers, Arlon; High Frequency Laminate |
Call for latest specs. |
Call for latest specs. |
| CEM-1/2 |
|
|
| Surface Finishes Available | Non-RoHs | RoHs |
| Tin Lead HASL |
X |
|
| Lead Free HASL |
|
X |
| Immersion Gold |
|
X |
| Immersion Tin |
|
X |
| OSP |
|
X |
| Immersion Silver |
|
X |
| Wire Bondable GOLD |
N/A |
N/A |
| Other Board Attributes | Details |
| Minimum Core Thickness Without Copper |
0.002" |
| Minimum SMT Pitch |
0.0025" |
| Minimum BGA Pitch |
0.004" |
| Via Technology | Blind Vias, Buried Vias, Micro Vias, Tented Vias
Conductive/Nonconductive Plugged Vias, Via in Pad |
| Fab Technology/Special Processes | Countersink, Counterbore,
Routed Array, V Score
Jump Score, Heatsink, Edge Milling/Beleving/Plating
Plated Edges, Plated Slots,
Controlled Dielectric
Class 3, BGA
|
| Impedance Control Tolerance | +/- 10% to +/- 5% |
| Copper Weight Range | 0.3 oz to 8.0 oz |
| Surface Finishing | HASL, Lead free HASL (RoHS), OSP (Entek)
Immersion Silver,
Immersion Tin, Carbon Ink
ENIG, Electrolytic Flash Gold, Hard Gold
Wirebondable Gold, Gold Finger, Peelable Mask |
| Solder Mask Colors | White, Yellow, Green, Red, Blue, Black
Matte Green, Matte Black |
| Legend Colors | White, Yellow, Red, Black |
Etch
Factor: These are presented as a function of the copper weight,
applying to all 3 categories:
|
|
|
Oz.
Wt. Of Copper
|
Etch
Allowance
|
|
Inner
Layer
|
2
oz.
1 oz.
½ oz.
|
.002"
.001"
.0005"
|
Per
side
Per side
Per side
|
Outer
Layer
|
2
oz.
1 oz.
½ oz.
|
.002"
.001"
.0005"
|
Per
side
Per side
Per side
|
