About PNC Inc.
Our 50,000 sq. ft. headquarters located in Nutley, NJ, features a fully capable printed circuit board assembly department in addition to our Bare Board fabrication and Electronic design departments. Our total concept model allows us to offer quick turn PCB assembly services from prototype to volume quantities. Our Midwest facility in Elk Grove, IL is also fully equipped to handle large quantity circuit board assembly runs and both locations are capable of SMT assembly as well as through-hole insertion and mixed technologies.
As a part of our Total Concept philosophy wherein we offer turnkey PCB board assembly services, we can turn a concept into a ready-to-use prototype in as little as one to two days (see turnkey graphic below for more details about our PCB assembly timelines). Our advantage stems from having electronic design, Bare board manufacturing and PCB Assembly Services in one facility.
Please see the list below to see our CM capabilities with regards to printed circuit board assembly services.
Turnkey Contract Manufacturing - Fast Turnaround
Our Contract manufacturing capabilities include, full inline SMT assembly as well as thru-hole/ mixed technology assembly from prototype to production serving the Military, Medical, Automotive and numerous commercial industries. PNC offers full turnkey service, to kitted assemblies with RoHs compliant or leaded solder. We also offer complete testing, IC programming, and inspection services along with SMT and Thru-hole rework. PNC's quality system ensures that our employees are certified to IPC-A-610 and IPC-J-STD Class III to meet or exceed customer expectations. Our SMT area is also ITAR restricted to service military requirements and is ESD protected.
Contract Manufacturing Capabilities
- Prototype through Production runs
- SMT, Thru-hole and Mixed Technology
- ITAR Restricted
- Fine Pitch Components
- ESD Compliant to ANSI/ESD S20.20
- Parts Procurement-Full Turnkey, Full consignment or partial consignment
- RoHs and leaded assembly
- Water soluble and no-clean chemistries
- BGA and Micro BGA Placement and Reflow
- x-Ray & AOI Inspection
- Full Functional Testing
- IC(Device) programming
- Conformal coating
- Potting services
- Burn-in, temperature & humidity cycling
- Pin insertion and press fit connectors
- Higher level assembly-Box build and configuration of finished product
- KANBAN/ JIT programs