PNC INC. - Printed Circuit Board manufacturing tolerances

Shop Tolerance
Standard
Advanced
Minimum Outer Line Width
.005"
.003"
Minimum Outer Space, Trace / Trace
.005"
.003"
Minimum Inner Space, Trace / Trace
.005"
.003"
Minimum Outer Space, Trace / Pad
.005"
.003"
Minimum Space, PCB Edge to Conductor
.008"
.005"
Lay-to-Layer Registration
+/- .005"
+/- .003"
Maximum Finished PCB Thickness
0.250"
0.275"
Minimum Board Thickness Tolerance
+/- 10%
+/- 5%
Dimensions - Hole Location
+/- .001"
+/- .001"
Dimensions - Hole Location
+/- .001"
+/- .001"
Dimensions - Hole Location
+/- .001"
+/- .001"
Dimensions - Hole Location
+/- .001"
+/- .001"
Dimensions - Hole Location
+/- .001"
+/- .001"
Dimensions - Hole Location
+/- .001"
+/- .001"
Pad to Hole
Standard
Advanced
Minimum Plated Hole Size
.005"
.003"
Minimum Inner Line Width
.008"
.004"
Tolerance - Plated Hole Size
+/- .003"
+ .002"-.001"
Minimum Outer Non-Plated Hole to Trace Spacing
.008"
.004"
Minimum Inner Non-Plated Hole to Trace Spacing
010"
005"
Drilling
Standard
Advanced
Minimum Drill Size
.006"
.004"
Minimum Inner Line Width
.008"
.004"
Maximum Drille Hole Size (Above .257"is routed)
.257"
.257"
Minimum Aspect Ratio
12:1
30:1
Testing Capabilities
Standard
Advanced
Minimum Component Pitch
.010"
.008"
Volts
100 Volts
250 Volts
Current
50mA
50mA
Resistance - Low
100 ohms
10 ohms
Resistance - High
10 M ohms
10 M ohms
Soldermask Criteria
Standard
Advanced
SMT Minimum Pad Spacing
.007"
.004"
Minimum Soldermask Dam
.005"
.0025"
Materials Available
Tg C
DK
FR4-04; Standard Multifunctional
150°
4.25 - 4.60
FR4-06; High Performance Epoxy Laminated
170°
4.29 - 4.60
FR4-08; High Performance, High Speed, High Tg
180°
3.7 - 3.8
GETEX
175-185°
3.8 - 4.2
Polyimide
230-260°
4.2 - 4.6
ISOLA 370HR
180°
3.94 - 4.04
Teflon, Rogers, Arlon; High Frequency Laminate
Call for latest specs.
Call for latest specs.
CEM-1/2
 
 
Materials Available
Tg C
DK
FR4-04; Standard Multifunctional
150°
4.25 - 4.60
FR4-06; High Performance Epoxy Laminated
170°
4.29 - 4.60
FR4-08; High Performance, High Speed, High Tg
180°
3.7 - 3.8
GETEX
175-185°
3.8 - 4.2
Polyimide
230-260°
4.2 - 4.6
ISOLA 370HR
180°
3.94 - 4.04
Teflon, Rogers, Arlon; High Frequency Laminate
Call for latest specs.
Call for latest specs.
CEM-1/2
 
 
Surface Finishes Available
Non-RoHs
RoHs
Tin Lead HASL
x
 
Lead Free HASL
 
x
Immersion Gold
 
x
Immersion Tin
 
x
OSP
 
x
Immersion Silver
 
x
Wire Bondable GOLD
N/A
N/A
Other Board Attributes
Details
Minimum Core Thickness Without Copper
0.002"
Minimum SMT Pitch
0.010"
Minimum BGA Pitch
0.0157"(0.4mm)
Via Technology
Blind Vias, Buried Vias, Micro Vias, Tented Vias Conductive/Nonconductive Plugged Vias, Via in Pad
Fab Technology/Special Processes
Countersink, Counterbore, Routed Array, V Score Jump Score, Heatsink, Edge Milling/Beleving/Plating Plated Edges, Plated Slots, Controlled Dielectric Class 3, BGA
Impedance Control Tolerance
+/- 10% to +/- 5%
Copper Weight Range
0.5 oz to 8.0 oz
Surface Finishing
HASL, Lead free HASL (RoHS), OSP (Entek) Immersion Silver, Immersion Tin, Carbon Ink ENIG, Electrolytic Flash Gold, Hard Gold Wirebondable Gold, Gold Finger, Peelable Mask
Solder Mask Colors
White, Yellow, Green, Red, Blue, Black Matte Green, Matte Black
Legend Colors
White, Yellow, Red, Black

 

Oz. Wt. Of Copper
Etch Allowance
Inner Layer
2 oz.
1 oz.
½ oz
.002"   Per side
.001"   Per side
.0005"    Per side
Outer Layer
2 oz.
1 oz.
½ oz.
.002"   Per side
.001"   Per side
.0005"   Per side

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