SMT Screen Printer-MPM/SPM
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Automatic
Alignment System
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Metal
Squeegee Blade with 30" print area
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Under
stencil wipe system
MyData SMT Pick and Place lines,
MY9 (2005) and MY9E(2006)
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Micro BGA and 0402 parts capability.
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Rated at 21,000 parts per hour.
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Versatile machines for almost all kinds of parts.
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Able to take very small strips (as small as five parts), Very
useful for making prototypes.
VITRONICS Convection Reflow Oven SMR-400
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Seven Zone Heating
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Temperature profiler
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Nitrogen capable
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PC controlled with adjustable Belt speed
UNIVERSAL thru hole Inserter and
Sequencer Combo VCD 6241B
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60 Station sequencer with REFIRE.
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Part verifier
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Pass Through board handling with loader and unloader
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Board Error Correction
Contact
Systems Automatic Thru hole parts locaters
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Parts Locaters CS 400 E (3 units)
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Rotary Bin systems CS 201.(2 units)
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Parts wall system CS-740BD
ERSA EWS 500F Wave Soldering System: Used for
leaded Solder only
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Temperature Profiler and Computer controlled
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Automatic Spray Fluxer, and Foam Fluxer combo.
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Dual Waves, Laminar and High Energy Chip wave for SMD components
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Five bottom and one top Preheaters-
Total 10 feet of Preheaters
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Automatic Conveyor Finger cleaner
Manncorp
Wave Soldering System: Series 28, Model 400: Used for Lead
Free Solder only
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Temperature profiler
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Dual Wave, Laminar and High Energy oscillating Chip wave for SMD
components
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Two Convection preheater Chambers
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Nitrogen capable
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Automatic Spray Fluxer
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Automatic Conveyor Finger cleaner
Part Preparation Units
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Tape and Reel, axial and radial cut and form machines
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Loose Radial part prep unit
SLIDE LINE Manual Assembly
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Four lines with 24" board width capacity
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Completely segregated
lines for Lead Free Assembly
Quality
Control:
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Testronics Automated
Optical Inspection Machine, Model 505
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Glenbrook Live X-Ray Machine Unit for BGA inspection, Model
RTX-113
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Check-Sum
In-Circuit Testing Machine
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Mantis Visual Inspection unit (Four Units)
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Microscopes (two units)
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Oscilloscopes (two units)
Thermotron Environmental
Testing Chamber Model SE-300-2
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Chamber
size 24”x26”x28”
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Temperature:
-400 C to 1800 C
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Humidity:
10% RH to 98% RH
MISC.
Services, Capabilities & Equipment:
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Programming IC Chips: Data I/O IC programmer and
Microchip MPLAB ICD2 PIC chip programmer
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Mechanical Assembly: Complete Box build service
with dedicated areas for mechanical assembly
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Hardware Installation: Various equipment for
Hardware installation
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Functional Testing: Complete functional
testing with trouble shooting and repairing capability.
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Potting of PCB assemblies: Separate Area and
equipment for potting of PCB assembly
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Baking of Raw Boards: Precision Quincy thermal oven Model 41-350.
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Stock Room: Fully computerized stock
room for managing turn key or customer supplied parts
