BGA | BGA Capabilities

At PNC Inc., with state-of-the-art BGA placement equipment, refined BGA assembly processes and X-ray test equipment, we can build high-quality BGA boards.



PNC’s SMT production teams carefully review PC board files, BGA datasheets and BGA ball sizes to make an optimized custom thermal profile for each job. For example, when the ball size is larger than normal, the profile will be optimized to localize heating on the internal BGA to prevent voids.
IPC class II standards are followed, unless otherwise specified, to keep the void as minimal as possible with respect to the total solder ball diameter. Vision-centering technology in their pick-and-place machines inspect ball-in BGA’s before placement.

 

 With versatile specifications like being able to handle BGA packages from 1 x 1 mm up to 50 x 50 mm, a minimum pitch of 0.4 mm and placement accuracy at +/- 0.03 mm, our assembly department is sure to be able to handle any of our customers’ specifications.

 

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