At PNC Inc., with state-of-the-art BGA placement equipment, refined BGA assembly processes and X-ray test equipment, we can build high-quality BGA boards.
PNC’s SMT production teams carefully review PC board files, BGA datasheets and BGA ball sizes to make an optimized custom thermal profile for each job. For example, when the ball size is larger than normal, the profile will be optimized to localize heating on the internal BGA to prevent voids.
IPC class II standards are followed, unless otherwise specified, to keep the void as minimal as possible with respect to the total solder ball diameter. Vision-centering technology in their pick-and-place machines inspect ball-in BGA’s before placement.
With versatile specifications like being able to handle BGA packages from 1 x 1 mm up to 50 x 50 mm, a minimum pitch of 0.4 mm and placement accuracy at +/- 0.03 mm, our assembly department is sure to be able to handle any of our customers’ specifications.
PNC Inc. offers every solution in the PCB arena. This includes design, fabrication, assembly and a number of value-added services. With these capabilities and our facilities around the country, we are able to provide quick-turn prototypes and large-scale production all under the same roof. We pride ourselves on constant improvement and invest millions each year into making sure we have the latest technology to make our processes as efficient as possible.
PNC INC, 115 East Centre St.
Nutley, NJ, 07110
Phone: (973) 284-1600