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PNC INC. - Printed Circuit Board manufacturing tolerances

Shop Tolerance
Standard
Advanced
 
Minimum Outer Line Width
.005"
.003"
 
Minimum Inner Line Width
.005"
.003"
 
Minimum Outer Space, Trace / Trace
.005"
.003"
 
Minimum Inner Space, Trace / Trace
.005"
.003"
 
Minimum Outer Space, Trace / Pad
.005"
.003"
 
Minimum Space, PCB Edge to Conductor
.008"
.005"
 
Lay-to-Layer Registration
+/- .005"
+/- .003"
 
Maximum Finished PCB Thickness
0.250"
0.275"
 
Minimum Board Thickness Tolerance
+/- 10%
+/- 5%
 
Dimensions - Hole Location
+/- .001"
+/- .001"
 
Dimensions - Fab O. D.
+/- .010"
+/- .005"
 
Warpage (flatness of finished board)
0.75%
0.50%
 
Minimum Component Pitch
.010"
.008"
 
Minimum Dielectric Thickness
.004"
.003"
 
Maximum Number of Layers
18
40
 
Pad to Hole
Standard
Advanced
 
Minimum Plated Hole Size
.005"
.003"
 
Minimum Inner Line Width
008"
.004"
 
Tolerance - Plated Hole Size
+/- .003"
+ .002"-.001"
 
Minimum Outer Non-Plated Hole to Trace Spacing
.008"
.004"
 
Minimum Inner Non-Plated Hole to Trace Spacing
010"
005"
 
Drilling
Standard
Advanced
 
Minimum Drill Size
.006"
.004"
 
Maximum Drille Hole Size (Above .257"is routed)
.257"
.257"
 
Minimum Aspect Ratio
12:1
30:1
 
Testing Capabilities
Standard
Advanced
 
Minimum Component Pitch
.010"
.008"
 
Volts
100 Volts
250 Volts
 
Current
50mA
50mA
 
Resistance - Low
100 ohms
10 ohms
 
Resistance - High
10 M ohms
10 M ohms
 
Soldermask Criteria
Standard
Advanced
 
SMT Minimum Pad Spacing
.007"
.004"
 
Minimum Soldermask Dam
.005"
.0025"
 
Materials Available
Tg C
DK
 
FR4-04; Standard Multifunctional
150°
4.25 - 4.60
 
FR4-06; High Performance Epoxy Laminated
170°
4.29 - 4.60
 
FR4-08; High Performance, High Speed, High Tg
180°
3.7 - 3.8
 
GETEX
175-185°
3.8 - 4.2
 
Polyimide
230-260°
4.2 - 4.6
 
ISOLA 370HR
180°
3.94 - 4.04
 
Teflon, Rogers, Arlon; High Frequency Laminate
Call for latest specs.
Call for latest specs.
 
CEM-1/2
 
 
 
Surface Finishes Available
Non-RoHs
RoHs
 
Tin Lead HASL
x
 
 
Lead Free HASL
 
x
 
Immersion Gold
 
x
 
Immersion Tin
 
x
 
OSP
 
x
 
Immersion Silver
 
x
 
Wire Bondable GOLD
 
x
 
CEM-1/2
N/A
N/A
 
Surface Finishes Available
Non-RoHs
RoHs
 
Tin Lead HASL
x
 
 
Lead Free HASL
 
x
 
Immersion Gold
 
x
 
Immersion Tin
 
x
 
OSP
 
x
 
Immersion Silver
 
x
 
Wire Bondable GOLD
 
x
 
CEM-1/2
N/A
N/A
 
Other Board Attributes
Details
 
Minimum Core Thickness Without Copper
0.002"
 
Minimum SMT Pitch
0.010"
 
Minimum BGA Pitch
0.0157"(0.4mm)
 
Via Technology
Blind Vias, Buried Vias, Micro Vias, Tented Vias Conductive/Nonconductive Plugged Vias, Via in Pad
 
Fab Technology/Special Processes
Countersink, Counterbore, Routed Array, V Score Jump Score, Heatsink, Edge Milling/Beleving/Plating Plated Edges, Plated Slots, Controlled Dielectric Class 3, BGA
 
Impedance Control Tolerance
+/- 10% to +/- 5%
 
Copper Weight Range
0.5 oz to 8.0 oz
 
Surface Finishing
HASL, Lead free HASL (RoHS), OSP (Entek) Immersion Silver, Immersion Tin, Carbon Ink ENIG, Electrolytic Flash Gold, Hard Gold Wirebondable Gold, Gold Finger, Peelable Mask
 
Solder Mask Colors
White, Yellow, Green, Red, Blue, Black Matte Green, Matte Black
 
Legend Colors
White, Yellow, Red, Black
 
 
Oz. Wt. Of Copper
Etch Allowance
 
Inner Layer
2 oz.
1 oz.
½ oz.
.002"
.001"
.0005"
Per side
Per side
Per side
 
 
Outer Layer
2 oz.
1 oz.
½ oz.
.002"
.001"
.0005"
Per side
Per side
Per side
 
 
 

Pc Boards

PNC offers myriad production and assembly services from quick-turn prototypes to high-volume orders. With a vast 50,000 sq. ft. facility and millions of dollars being invested into it on a regular basis, we have the know-how, the capability and the technology to handle any size order in virtually any time frame.

Contact Adress

  • Location:

    PNC INC, 115 East Centre St, Nutley, NJ, 07110

  • Phone: (973) 284-1600
  • Email:sales@pnconline.com

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